Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests

• Published in: Microelectronics and reliability Vol. 74; pp. 136 - 146
• Main Authors: Heilmann, Jens, Nikitin, Ivan, Zschenderlein, Uwe, May, Daniel, Pressel, Klaus, Wunderle, Bernhard
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.07.2017
• Subjects: Accelerated fatigue test; Continuum mechanics; Lifetime modelling; Physics of failure; Reliability; Sintered silver; Physics of failure; Continuum mechanics; Accelerated fatigue test; Reliability; Lifetime modelling; Sintered silver

Integration of more functionality and smaller chips into decreasing package volume leads to increasing heat generation. In addition, the use of new compound semiconductors like SiC and GaN require a high thermal conductivity of the interconnect materials. One of the promising solutions is a layer of...