APA (7th ed.) Citation

Heilmann, J., Nikitin, I., Zschenderlein, U., May, D., Pressel, K., & Wunderle, B. (2017). Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests. Microelectronics and reliability, 74, 136-146. https://doi.org/10.1016/j.microrel.2017.04.016

Chicago Style (17th ed.) Citation

Heilmann, Jens, Ivan Nikitin, Uwe Zschenderlein, Daniel May, Klaus Pressel, and Bernhard Wunderle. "Reliability Experiments of Sintered Silver Based Interconnections by Accelerated Isothermal Bending Tests." Microelectronics and Reliability 74 (2017): 136-146. https://doi.org/10.1016/j.microrel.2017.04.016.

MLA (9th ed.) Citation

Heilmann, Jens, et al. "Reliability Experiments of Sintered Silver Based Interconnections by Accelerated Isothermal Bending Tests." Microelectronics and Reliability, vol. 74, 2017, pp. 136-146, https://doi.org/10.1016/j.microrel.2017.04.016.