The effects of cure temperature history on the stability of polyimide films

The effects of cure temperature history on the stability of hinged structure poly（4,4-oxydiphenylene pyromellitimide）（PMDA-ODA） polyimide were studied by dynamic mechanical analysis.The polyimide films were cured under different curing conditions and peeled off by substrate etching.It was found that...

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Published inJournal of semiconductors Vol. 34; no. 6; pp. 27 - 31
Main Author 宁文果 李珩 朱春生 罗乐 陈栋 段珍珍
Format Journal Article
LanguageEnglish
Published 01.06.2013
Subjects
Cures
Dynamic structural analysis
Etching
Glass transition temperature
Polyimide resins
Ramps
Semiconductors
Stability
动态力学分析
历史
固化温度
玻璃化转变温度
稳定性
聚酰亚胺膜
聚酰亚胺薄膜
铰链结构
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Abstract The effects of cure temperature history on the stability of hinged structure poly（4,4-oxydiphenylene pyromellitimide）（PMDA-ODA） polyimide were studied by dynamic mechanical analysis.The polyimide films were cured under different curing conditions and peeled off by substrate etching.It was found that a proper cure time and temperature ramp rate improves the stability in terms of higher glass transition temperature.Ninety minutes at 375℃or 200℃is a beneficial high glass transition temperature.The temperature ramp rate should be between 2℃/min and 10℃/min,which is neither too high nor too low.
AbstractList The effects of cure temperature history on the stability of hinged structure poly (4, 4-oxydiphenylene pyromellitimide) (PMDA-ODA) polyimide were studied by dynamic mechanical analysis. The polyimide films were cured under different curing conditions and peeled off by substrate etching. It was found that a proper cure time and temperature ramp rate improves the stability in terms of higher glass transition temperature. Ninety minutes at 375 degree C or 200 degree C is a beneficial high glass transition temperature. The temperature ramp rate should be between 2 degree C/min and 10 degree C/min, which is neither too high nor too low.
The effects of cure temperature history on the stability of hinged structure poly（4,4-oxydiphenylene pyromellitimide）（PMDA-ODA） polyimide were studied by dynamic mechanical analysis.The polyimide films were cured under different curing conditions and peeled off by substrate etching.It was found that a proper cure time and temperature ramp rate improves the stability in terms of higher glass transition temperature.Ninety minutes at 375℃or 200℃is a beneficial high glass transition temperature.The temperature ramp rate should be between 2℃/min and 10℃/min,which is neither too high nor too low.
Author 宁文果 李珩 朱春生 罗乐 陈栋 段珍珍
AuthorAffiliation The State Key Laboratories of Transducer Technology, Shanghai Institute of Microsystem and Information Technology,Chinese Academy of Sciences, Shanghai 200050, China University of Chinese Academy of Sciences, Beijing 100049, China R＆D Department, Jiangyin Changdian Advanced Packaging Co., LTD, Jiangyin 214431, China
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10.1016/S0168-583X(03)00669-4
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Notes curing of polymers; polyimide; stabilization; DMA
The effects of cure temperature history on the stability of hinged structure poly（4,4-oxydiphenylene pyromellitimide）（PMDA-ODA） polyimide were studied by dynamic mechanical analysis.The polyimide films were cured under different curing conditions and peeled off by substrate etching.It was found that a proper cure time and temperature ramp rate improves the stability in terms of higher glass transition temperature.Ninety minutes at 375℃or 200℃is a beneficial high glass transition temperature.The temperature ramp rate should be between 2℃/min and 10℃/min,which is neither too high nor too low.
Ning Wenguo,Li Heng,Zhu Chunsheng,Luo Le, Chen Dong,Duan Zhenzhen（ 1 The State Key Laboratories of Transducer Technology,Shanghai Institute of Microsystem and Information Technology. Chinese Academy of Sciences,Shanghai 200050,China ;2 University of Chinese Academy of Sciences,Beijing 100049,China; 3 R＆D Department,Jiangyin Changdian Advanced Packaging Co.,LTD,Jiangyin 214431,China ）
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Snippet The effects of cure temperature history on the stability of hinged structure poly（4,4-oxydiphenylene pyromellitimide）（PMDA-ODA） polyimide were studied by...
The effects of cure temperature history on the stability of hinged structure poly (4, 4-oxydiphenylene pyromellitimide) (PMDA-ODA) polyimide were studied by...
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SubjectTerms Cures
Dynamic structural analysis
Etching
Glass transition temperature
Polyimide resins
Ramps
Semiconductors
Stability
动态力学分析
历史
固化温度
玻璃化转变温度
稳定性
聚酰亚胺膜
聚酰亚胺薄膜
铰链结构
Title The effects of cure temperature history on the stability of polyimide films
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