Thermal performance of heat sink using nano-enhanced phase change material (NePCM) for cooling of electronic components

• Published in: Microelectronics and reliability Vol. 121; p. 114144
• Main Authors: Kumar, Anuj, Kothari, Rohit, Sahu, Santosh Kumar, Kundalwal, Shailesh Ishwarlal
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.06.2021
• Subjects: Heat sink; Nanoenhanced; Phase change material; Thermal conductivity enhancers; Thermal management; Thermal management; Thermal conductivity enhancers; Nanoenhanced; Phase change material; Heat sink

Present experimental study reports the thermal performance of nano-enhanced phase change material (NePCM) based thermal energy storage system for cooling of electronic components. The NePCM based heat sink (HS) cooling is a passive cooling technique that can eliminate the fan-based conventional cool...