APA (7th ed.) Citation

Kumar, A., Kothari, R., Sahu, S. K., & Kundalwal, S. I. (2021). Thermal performance of heat sink using nano-enhanced phase change material (NePCM) for cooling of electronic components. Microelectronics and reliability, 121, 114144. https://doi.org/10.1016/j.microrel.2021.114144

Chicago Style (17th ed.) Citation

Kumar, Anuj, Rohit Kothari, Santosh Kumar Sahu, and Shailesh Ishwarlal Kundalwal. "Thermal Performance of Heat Sink Using Nano-enhanced Phase Change Material (NePCM) for Cooling of Electronic Components." Microelectronics and Reliability 121 (2021): 114144. https://doi.org/10.1016/j.microrel.2021.114144.

MLA (9th ed.) Citation

Kumar, Anuj, et al. "Thermal Performance of Heat Sink Using Nano-enhanced Phase Change Material (NePCM) for Cooling of Electronic Components." Microelectronics and Reliability, vol. 121, 2021, p. 114144, https://doi.org/10.1016/j.microrel.2021.114144.