Random vibration analysis of 3-Arc-Fan compliant interconnects - Chung, Philip Y.; Sitaraman, Suresh K. (Microelectronics and reliability, 2018)
Keywords: Compliant interconnects; Finite-element analysis; Microelectronics packaging reliability; Random vibration fatigue; Random vibration fatigue; Microelectronics packaging reliability; Finite-element analysis; Compliant interconnects