Discoloration Resistance of Electrolytic Copper Foil Following 1,2,3-Benzotriazole Surface Treatment with Sodium Molybdate

• Published in: Coatings (Basel) Vol. 8; no. 12; p. 427
• Main Authors: Shin, Dong-Jun, Kim, Yu-Kyoung, Yoon, Jeong-Mo, Park, Il-Song
• Format: Journal Article
• Language: English
• Published: Basel MDPI AG 01.12.2018
• Subjects: Benzotriazole; Chromating; Copper; Corrosion potential; Corrosion prevention; Corrosion resistance; Deposition; Discoloration; Electrochemical corrosion; Electrodes; Heat resistance; Humidity; Information industry; Metal foils; Photoelectrons; Protective coatings; Sodium molybdate; Standard deviation; Strain hardening; Surface properties; Surface treatment; Thermal resistance; X ray photoelectron spectroscopy; United States > US
• ISSN: 2079-6412; 2079-6412
• DOI: 10.3390/coatings8120427

The copper which an important component in the electronics industry, can suffer from discoloration and corrosion. The electrolytic copper foil was treated by 1,2,3-benzo-triazole (BTA) for an environmentally friendly non-chromate surface treatment. It was designed to prevent discoloration and improve corrosion resistance, consisted of BTA and inorganic sodium molybdate (Na2MoO4). Also the ratio of the constituent compounds and the deposition time were varied. Electrochemical corrosion of the Cu-BTA was evaluated using potentiodynamic polarization. Discoloration was analyzed after humidity and heat resistance conditioning. Surface characteristics were evaluated using scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS). Increasing corrosion potential and decreasing current density were observed with increasing Na2MoO4 content. A denser protective coating formed as the deposition time increased. Although chromate treatment under severe humidity (80% humidity, 80 °C, 100 h) provided the highest humidity resistance, surface treatment with Na2MoO4 had better heat discoloration inhibition under severe heat-resistant conditions (180 °C, 10 min). When BTA reacts with Cu to form the Cu-BTA-type insoluble protective film, Na2MoO4 accelerates the film formation without being itself adsorbed onto the film. Therefore, the addition of Na2MoO4 increased anticorrosive efficiency through direct/indirect action.