A general design strategy for thermoelectric interface materials in n-type Mg3Sb1.5Bi0.5 single leg used in TEGs - Wu, Xinzhi; Han, Zhijia; Zhu, Yongbin; Deng, Biao; Zhu, Kang; Liu, Chengyan; Jiang, Feng; Liu, Weishu (Acta materialia, 2022)
Keywords: bonding strength; interfacial resistivity; interfacial thermal stability; Mg3Sb1.5Bi0.5; Thermoelectric interface materials; Thermoelectric interface materials; interfacial resistivity; interfacial thermal stability; bonding strength; Mg3Sb1.5Bi0.5