Plasma-induced growth mechanism of surface-state silver oxide in nanoscale for low-temperature bonding technology

For microelectronics packaging, we have previously invented a novel solid-state bonding technology by using in-situ self-reduction process of surface-state silver oxide. However, the underlying plasma-induced growth mechanism of surface-state silver oxide has still remained unclear in determining th...

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Published inMaterials characterization Vol. 199; p. 112830
Main Authors Wang, Taiyu, Gu, Songzhao, Fang, Yexing, Zhang, Donglin, Xie, Xiaochen, Qu, Zhibo, Wang, Yong, Zhao, Xiuchen, Wu, Jiaqi, Lee, Chin C., Huo, Yongjun
Format Journal Article
LanguageEnglish
Published Elsevier Inc 01.05.2023
Subjects
Growth mechanism
Microelectronics packaging
Morphological transformation
Plasma-induced oxidation
Surface-state silver oxide
Plasma-induced oxidation
Surface-state silver oxide
Microelectronics packaging
Morphological transformation
Growth mechanism
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Abstract For microelectronics packaging, we have previously invented a novel solid-state bonding technology by using in-situ self-reduction process of surface-state silver oxide. However, the underlying plasma-induced growth mechanism of surface-state silver oxide has still remained unclear in determining the optimal growth conditions for solid-state bonding. In the current study, the chemical state and crystallography of the plasma grown silver oxide nanocrystalline have been firstly confirmed by the X-ray photoelectron spectroscopy (XPS) and X-ray diffraction (XRD) methods. Afterwards, the morphological transformation, surface roughness and size distribution of nanoparticles have been statistically studied with the scanning electron microscopy (SEM) and atomic force microscopy (AFM), demonstrating the impact of plasma discharge power and oxidation time on the silver oxide nanocrystalline. Moreover, the growth mechanism of surface-state silver oxide in nanoscale has been thoroughly elaborated and summarized into four distinctive stages, namely, (1) adsorption and nucleation, (2) particle accumulation, (3) hillocks formation, and (4) huge island formation. With its growth mechanism well-clarified, the surface-state silver oxide in nanoscale is expected to have a great potential as a temporary bonding medium in the development of low-temperature solid-state bonding technology for the advanced integrated circuits (IC) packaging with ultra-fine pitch. [Display omitted] •Surface-state silver oxide in nanoscale has been successfully grown by plasma on the silver thin film.•Various silver oxide nanocrystalline samples have been grown under different discharge power and growth time.•The growth mechanism of surface-state silver oxide in nanoscale has been categorized into four distinctive stages.•The particle accumulation stage has been discovered to be the optimal growth mode for solid-state bonding technology.
AbstractList For microelectronics packaging, we have previously invented a novel solid-state bonding technology by using in-situ self-reduction process of surface-state silver oxide. However, the underlying plasma-induced growth mechanism of surface-state silver oxide has still remained unclear in determining the optimal growth conditions for solid-state bonding. In the current study, the chemical state and crystallography of the plasma grown silver oxide nanocrystalline have been firstly confirmed by the X-ray photoelectron spectroscopy (XPS) and X-ray diffraction (XRD) methods. Afterwards, the morphological transformation, surface roughness and size distribution of nanoparticles have been statistically studied with the scanning electron microscopy (SEM) and atomic force microscopy (AFM), demonstrating the impact of plasma discharge power and oxidation time on the silver oxide nanocrystalline. Moreover, the growth mechanism of surface-state silver oxide in nanoscale has been thoroughly elaborated and summarized into four distinctive stages, namely, (1) adsorption and nucleation, (2) particle accumulation, (3) hillocks formation, and (4) huge island formation. With its growth mechanism well-clarified, the surface-state silver oxide in nanoscale is expected to have a great potential as a temporary bonding medium in the development of low-temperature solid-state bonding technology for the advanced integrated circuits (IC) packaging with ultra-fine pitch. [Display omitted] •Surface-state silver oxide in nanoscale has been successfully grown by plasma on the silver thin film.•Various silver oxide nanocrystalline samples have been grown under different discharge power and growth time.•The growth mechanism of surface-state silver oxide in nanoscale has been categorized into four distinctive stages.•The particle accumulation stage has been discovered to be the optimal growth mode for solid-state bonding technology.
ArticleNumber 112830
Author Zhang, Donglin
Xie, Xiaochen
Qu, Zhibo
Wu, Jiaqi
Gu, Songzhao
Zhao, Xiuchen
Wang, Taiyu
Fang, Yexing
Lee, Chin C.
Wang, Yong
Huo, Yongjun
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CitedBy_id crossref_primary_10_1021_acsomega_4c03608
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Cites_doi 10.3891/acta.chem.scand.27-2623
10.1007/BF00354389
10.1016/j.matdes.2020.108726
10.1016/j.actamat.2015.02.011
10.1116/1.1537716
10.1039/b103226g
10.1149/1.3577596
10.1016/j.apsusc.2021.151845
10.1016/j.matchemphys.2021.125159
10.1088/1361-6528/aac031
10.1016/j.vacuum.2015.02.010
10.1115/1.4006705
10.1016/j.actamat.2016.07.004
10.1016/j.scriptamat.2020.11.013
10.1063/1.1406928
10.1557/mrs.2015.8
10.1063/1.102270
10.1016/j.matlet.2012.07.018
10.1039/c2cp22472k
10.1007/BF02667476
10.1016/j.msea.2017.07.034
10.1109/TED.2013.2248368
10.1016/0168-583X(93)95441-7
10.1116/1.578855
10.1038/srep09734
10.1016/j.microrel.2011.03.038
10.1007/s10854-015-4011-2
10.1021/acs.jpcc.7b06030
10.1023/B:OXID.0000016275.96500.24
10.1016/j.scriptamat.2016.10.015
10.1109/MCSE.2017.29
10.1016/j.mtla.2018.10.017
10.2320/matertrans.MRA2008269
10.1039/C5NR07145C
10.1006/jcat.1998.2388
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Keywords Plasma-induced oxidation
Surface-state silver oxide
Microelectronics packaging
Morphological transformation
Growth mechanism
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References Zheludkevich, Gusakov, Voropaev, Vecher, Kozyrski, Raspopov (bb0115) 2004; 61
Edwards, Williams, Fromhold, Barnes, Wey, Neely, Whitaker (bb0180) 1993; 79
Wu, Si, Zhang, Zhang, Li, Mi, Jiang, Rong, Chen, Fang (bb0185) 2018; 29
El Mel, Stephant, Hamon, Thiry, Chauvin, Chettab, Gautron (bb0130) 2016; 8
Kim, Itoh, Suga (bb0065) 2003; 21
Zheludkevich, Gusakov, Voropaev (bb0205) 2004
Karakaya, Thompson (bb0095) 1992; 13
Derooij (bb0175) 1989; 13
Li, Liu, Chen (bb0055) 2015; 34
Mu, Huang, Nogita (bb0020) 2012; 86
Asama, Matsuda, Ogura, Sano, Takahashi, Hirose (bb0105) 2017; 702
Ko, K.N. (bb0060) 2012; 52
Sha, Lin, Lee (bb0075) 2012; 134
Di Cioccio, Gueguen, Taibi, Landru (bb0035) 2011; 158
Osborne, Harris, Roberts, Chambers (bb0165) 2001; 72
Nagy, Mestl, Herein, Weinberg, Kitzelmann, Schlogl (bb0190) 1999; 182
Reddy (bb0170) 1995; 30
Chang, Wang, Ouyang (bb0085) 2021; 274
Hsiao, Lin (bb0030) 2016; 27
Liu, Lin, Huang, Chu, Chen, Lyu, Chen, Tu (bb0070) 2015; 5
Chen, Feng, Chen, Liu, Li, Liu, Zhang, Cao, Zhang, Shi (bb0140) 2017; 128
Schon (bb0160) 1973; 27
Rocha, Oestereich, Demidov, Haevecker (bb0120) 2012; 14
Zhang, Xue, Wang (bb0015) 2020; 192
Liu, Chu, Tu (bb0025) 2016; 117
Bhan, Nag, Miller, Gregory (bb0150) 1994; 12
Chen, Tu (bb0010) 2015; 40
Levenson (bb0195) 1989; 55
Sheikhi, Huo, Shi, Lee (bb0050) 2021; 194
Wu, Tseng, Li, Chang, Hsieh (bb0145) 2015; 118
Kunimune, Kuramoto, Ogawa, Sugahara, Nagao, Suganuma (bb0080) 2015; 89
Morita, Yasuda, Ide, Akada, Hirose (bb0100) 2008; 49
Waterhouse, Bowmaker, Metson (bb0125) 2001; 3
Rooij (bb0200) 1989; 4 th, Toulouse
El Mel, Stephant, Molina-Luna, Gautron, Haik, Tabet (bb0135) 2017; 121
Zhang, Pan, Zhang, Xu, Jiang, Liu, Gong, Wu (bb0155) 2003; 19
Peng, Zhang, Li, Tan (bb0040) 2013; 60
Wu, Huo, Lee (bb0110) 2018; 4
Ruythooren, Beltran, Labie (bb0045) 2007; 315-318
Theis, Wong (bb0005) 2017; 19
Chang, Wang, Hung, Chen, Ouyang (bb0090) 2022; 576
Karakaya (10.1016/j.matchar.2023.112830_bb0095) 1992; 13
Zheludkevich (10.1016/j.matchar.2023.112830_bb0115) 2004; 61
Wu (10.1016/j.matchar.2023.112830_bb0185) 2018; 29
Ruythooren (10.1016/j.matchar.2023.112830_bb0045) 2007; 315-318
Kim (10.1016/j.matchar.2023.112830_bb0065) 2003; 21
Theis (10.1016/j.matchar.2023.112830_bb0005) 2017; 19
Asama (10.1016/j.matchar.2023.112830_bb0105) 2017; 702
Osborne (10.1016/j.matchar.2023.112830_bb0165) 2001; 72
Di Cioccio (10.1016/j.matchar.2023.112830_bb0035) 2011; 158
Nagy (10.1016/j.matchar.2023.112830_bb0190) 1999; 182
Kunimune (10.1016/j.matchar.2023.112830_bb0080) 2015; 89
Ko (10.1016/j.matchar.2023.112830_bb0060) 2012; 52
Levenson (10.1016/j.matchar.2023.112830_bb0195) 1989; 55
Wu (10.1016/j.matchar.2023.112830_bb0110) 2018; 4
Reddy (10.1016/j.matchar.2023.112830_bb0170) 1995; 30
Liu (10.1016/j.matchar.2023.112830_bb0070) 2015; 5
Morita (10.1016/j.matchar.2023.112830_bb0100) 2008; 49
Zhang (10.1016/j.matchar.2023.112830_bb0015) 2020; 192
Peng (10.1016/j.matchar.2023.112830_bb0040) 2013; 60
Bhan (10.1016/j.matchar.2023.112830_bb0150) 1994; 12
Schon (10.1016/j.matchar.2023.112830_bb0160) 1973; 27
Edwards (10.1016/j.matchar.2023.112830_bb0180) 1993; 79
Chen (10.1016/j.matchar.2023.112830_bb0010) 2015; 40
Liu (10.1016/j.matchar.2023.112830_bb0025) 2016; 117
Chang (10.1016/j.matchar.2023.112830_bb0090) 2022; 576
El Mel (10.1016/j.matchar.2023.112830_bb0135) 2017; 121
Zheludkevich (10.1016/j.matchar.2023.112830_bb0205) 2004
Wu (10.1016/j.matchar.2023.112830_bb0145) 2015; 118
Chang (10.1016/j.matchar.2023.112830_bb0085) 2021; 274
Sha (10.1016/j.matchar.2023.112830_bb0075) 2012; 134
Rocha (10.1016/j.matchar.2023.112830_bb0120) 2012; 14
Waterhouse (10.1016/j.matchar.2023.112830_bb0125) 2001; 3
Zhang (10.1016/j.matchar.2023.112830_bb0155) 2003; 19
Hsiao (10.1016/j.matchar.2023.112830_bb0030) 2016; 27
Chen (10.1016/j.matchar.2023.112830_bb0140) 2017; 128
Mu (10.1016/j.matchar.2023.112830_bb0020) 2012; 86
El Mel (10.1016/j.matchar.2023.112830_bb0130) 2016; 8
Li (10.1016/j.matchar.2023.112830_bb0055) 2015; 34
Rooij (10.1016/j.matchar.2023.112830_bb0200) 1989; 4 th, Toulouse
Sheikhi (10.1016/j.matchar.2023.112830_bb0050) 2021; 194
Derooij (10.1016/j.matchar.2023.112830_bb0175) 1989; 13
References_xml – volume: 14
  start-page: 4554
  year: 2012
  end-page: 4564
  ident: bb0120
  article-title: The silver-oxygen system in catalysis: new insights by near ambient pressure X-ray photoelectron spectroscopy
  publication-title: Phys. Chem. Chem. Phys.
  contributor:
    fullname: Haevecker
– volume: 192
  year: 2020
  ident: bb0015
  article-title: New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints
  publication-title: Mater. Des.
  contributor:
    fullname: Wang
– volume: 117
  start-page: 146
  year: 2016
  end-page: 152
  ident: bb0025
  article-title: Scaling effect of interfacial reaction on intermetallic compound formation in Sn/cu pillar down to 1 μm diameter
  publication-title: Acta Mater.
  contributor:
    fullname: Tu
– volume: 79
  start-page: 676
  year: 1993
  end-page: 679
  ident: bb0180
  article-title: The oxidation of polycrystalline silver films by thermal, ground-state atomic oxygen
  publication-title: Nucl. Instrum. Methods Phys. Res., Sect. B
  contributor:
    fullname: Whitaker
– volume: 19
  start-page: 203
  year: 2003
  end-page: 207
  ident: bb0155
  article-title: Synthesis of silver oxide nano-scale thin films and photo-activated dynamic luminescence from their nanoparticles
  publication-title: Acta Physicochim.
  contributor:
    fullname: Wu
– volume: 128
  start-page: 41
  year: 2017
  end-page: 44
  ident: bb0140
  article-title: Analytical approach for describing the collapse of surface asperities under compressive stress during rapid solidstate bonding
  publication-title: Scr. Mater.
  contributor:
    fullname: Shi
– volume: 34
  start-page: 9
  year: 2015
  end-page: 14
  ident: bb0055
  article-title: Developments of copper-to-copper low temperature bonding technology for 3D packaging
  publication-title: Electron. Compon. Mater.
  contributor:
    fullname: Chen
– volume: 315-318
  year: 2007
  ident: bb0045
  article-title: Cu-Cu bonding alternative to solder based micro-bumping
  publication-title: Electronics Packaging Technology Conference Proceedings
  contributor:
    fullname: Labie
– volume: 86
  start-page: 46
  year: 2012
  end-page: 49
  ident: bb0020
  article-title: Anisotropic mechanical properties of Cu6Sn5 and (cu, Ni)(6)Sn-5
  publication-title: Mater. Lett.
  contributor:
    fullname: Nogita
– volume: 194
  year: 2021
  ident: bb0050
  article-title: Low temperature VECSEL-to-diamond heterogeneous integration with ag-in Spinodal nanostructured layer
  publication-title: Scr. Mater.
  contributor:
    fullname: Lee
– volume: 30
  start-page: 281
  year: 1995
  end-page: 307
  ident: bb0170
  article-title: Effect of low earth orbit atomic oxygen on spacecraft materials
  publication-title: J. Mater. Sci.
  contributor:
    fullname: Reddy
– volume: 3
  start-page: 3838
  year: 2001
  end-page: 3845
  ident: bb0125
  article-title: The thermal decomposition of silver (I, III) oxide: a combined XRD, FT-IR and Raman spectroscopic study
  publication-title: Phys. Chem. Chem. Phys.
  contributor:
    fullname: Metson
– volume: 27
  start-page: 2201
  year: 2016
  end-page: 2205
  ident: bb0030
  article-title: The formation and conversion of intermetallic compounds in the cu pillar Sn-ag micro-bump with ENEPIG cu substrate under current stressing
  publication-title: J. Mater. Sci. Mater. Electron.
  contributor:
    fullname: Lin
– volume: 27
  start-page: 2623
  year: 1973
  ident: bb0160
  article-title: ESCA studies of Ag, Ag2O and AgO
  publication-title: Acta Chem. Scand.
  contributor:
    fullname: Schon
– volume: 13
  start-page: 363
  year: 1989
  end-page: 382
  ident: bb0175
  article-title: The oxidation of silver by atomic oxygen
  publication-title: ESA J.
  contributor:
    fullname: Derooij
– volume: 21
  start-page: 449
  year: 2003
  end-page: 453
  ident: bb0065
  article-title: Room temperature Cu-Cu direct bonding using surface activated bonding method
  publication-title: J. Vac. Sci. Technol. A
  contributor:
    fullname: Suga
– volume: 89
  start-page: 133
  year: 2015
  end-page: 140
  ident: bb0080
  article-title: Ultra thermal stability of LED die-attach achieved by pressureless ag stress-migration bonding at low temperature
  publication-title: Acta Mater.
  contributor:
    fullname: Suganuma
– volume: 49
  start-page: 2875
  year: 2008
  end-page: 2880
  ident: bb0100
  article-title: Bonding technique using Micro-scaled silver-oxide particles for in-situ formation of silver nanoparticles
  publication-title: Mater. Trans.
  contributor:
    fullname: Hirose
– volume: 61
  start-page: 39
  year: 2004
  end-page: 48
  ident: bb0115
  article-title: Oxidation of silver by atomic oxygen
  publication-title: Oxid. Met.
  contributor:
    fullname: Raspopov
– volume: 13
  start-page: 137
  year: 1992
  end-page: 142
  ident: bb0095
  article-title: The Ag-O (silver-oxygen) system
  publication-title: J. Phase Equilib.
  contributor:
    fullname: Thompson
– volume: 40
  start-page: 219
  year: 2015
  end-page: 222
  ident: bb0010
  article-title: Materials challenges in three-dimensional integrated circuits
  publication-title: MRS Bull.
  contributor:
    fullname: Tu
– volume: 118
  start-page: 147
  year: 2015
  end-page: 151
  ident: bb0145
  article-title: Characterization of Cu2O and Cu2O–Ag2O thin films synthesized by plasma oxidation
  publication-title: Vacuum
  contributor:
    fullname: Hsieh
– volume: 72
  start-page: 4025
  year: 2001
  end-page: 4041
  ident: bb0165
  article-title: Satellite and rocket-borne atomic oxygen sensor techniques
  publication-title: Rev. Sci. Instrum.
  contributor:
    fullname: Chambers
– start-page: 351
  year: 2004
  end-page: 358
  ident: bb0205
  article-title: Studies of the Surface Oxidation of Silver by Atomic Oxygen
  contributor:
    fullname: Voropaev
– volume: 158
  start-page: 81
  year: 2011
  end-page: 86
  ident: bb0035
  article-title: An overview of patterned metal/dielectric surface bonding: mechanism, alignment and characterization
  publication-title: J. Electrochem. Soc.
  contributor:
    fullname: Landru
– volume: 274
  year: 2021
  ident: bb0085
  article-title: Improvement of Ag films with highly (111) surface orientation for metal direct bonding technique: Nanotwinned structure and ion bombardment effect
  publication-title: Mater. Chem. Phys.
  contributor:
    fullname: Ouyang
– volume: 182
  start-page: 417
  year: 1999
  end-page: 429
  ident: bb0190
  article-title: The correlation of subsurface oxygen diffusion with variations of silver morphology in the silver–oxygen system
  publication-title: J. Catal.
  contributor:
    fullname: Schlogl
– volume: 52
  start-page: 302
  year: 2012
  end-page: 311
  ident: bb0060
  article-title: Low temperature bonding technology for 3D integration
  publication-title: Microelectron. Reliab.
  contributor:
    fullname: K.N.
– volume: 8
  start-page: 141
  year: 2016
  end-page: 148
  ident: bb0130
  article-title: Creating nanoporosity in silver nanocolumns by direct exposure to radio-frequency air plasma
  publication-title: Nanoscale
  contributor:
    fullname: Gautron
– volume: 12
  start-page: 699
  year: 1994
  end-page: 706
  ident: bb0150
  article-title: Chemical and morphological changes on silver surfaces produced by microwave generated atomic oxygen
  publication-title: J. Vac. Sci. Technol. A
  contributor:
    fullname: Gregory
– volume: 4
  start-page: 417
  year: 2018
  end-page: 422
  ident: bb0110
  article-title: Direct Ag-Ag bonding by in-situ reduction of surface oxides for advanced chip-package interconnection
  publication-title: Materialia
  contributor:
    fullname: Lee
– volume: 4 th, Toulouse
  start-page: 453
  year: 1989
  end-page: 462
  ident: bb0200
  article-title: An approach to long term prediction of the atomic oxygen effect on materials, in. European symposium on spacecraft materials in space
  publication-title: Environment
  contributor:
    fullname: Rooij
– volume: 29
  year: 2018
  ident: bb0185
  article-title: Strong damping of the localized surface plasmon resonance of Ag nanoparticles by Ag2O
  publication-title: Nanotechnology
  contributor:
    fullname: Fang
– volume: 60
  start-page: 1444
  year: 2013
  end-page: 1450
  ident: bb0040
  article-title: Cu-cu bond quality enhancement through the inclusion of a hermetic seal for 3-D IC
  publication-title: IEEE Trans. Electron Dev.
  contributor:
    fullname: Tan
– volume: 5
  start-page: 09734
  year: 2015
  ident: bb0070
  article-title: Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned cu
  publication-title: Sci. Rep.
  contributor:
    fullname: Tu
– volume: 702
  start-page: 398
  year: 2017
  end-page: 405
  ident: bb0105
  article-title: Low-temperature metal-to-alumina direct bonding process utilizing redox reaction between silver oxide and organic agent
  publication-title: Mater. Sci. Eng. A
  contributor:
    fullname: Hirose
– volume: 19
  start-page: 41
  year: 2017
  end-page: 50
  ident: bb0005
  article-title: The end of Moore’s law: a new beginning for information technology
  publication-title: Comput. Sci. Eng.
  contributor:
    fullname: Wong
– volume: 134
  year: 2012
  ident: bb0075
  article-title: 40 μm copper-silver composite Flip-Chip interconnect technology using solid-state bonding
  publication-title: J. Electron. Packag.
  contributor:
    fullname: Lee
– volume: 576
  year: 2022
  ident: bb0090
  article-title: Direct metal bonding using nanotwinned Ag films with (111) surface orientation under air atmosphere for heterogeneous integration
  publication-title: Appl. Surf. Sci.
  contributor:
    fullname: Ouyang
– volume: 121
  start-page: 19497
  year: 2017
  end-page: 19504
  ident: bb0135
  article-title: Kirkendall effect vs corrosion of silver nanocrystals by atomic oxygen: from solid metal silver to Nanoporous silver oxide
  publication-title: J. Phys. Chem. C
  contributor:
    fullname: Tabet
– volume: 55
  start-page: 2617
  year: 1989
  end-page: 2619
  ident: bb0195
  article-title: Grain boundary diffusion activation energy derived from surface roughness measurements of aluminum thin films
  publication-title: Appl. Phys. Lett.
  contributor:
    fullname: Levenson
– volume: 27
  start-page: 2623
  year: 1973
  ident: 10.1016/j.matchar.2023.112830_bb0160
  article-title: ESCA studies of Ag, Ag2O and AgO
  publication-title: Acta Chem. Scand.
  doi: 10.3891/acta.chem.scand.27-2623
  contributor:
    fullname: Schon
– volume: 30
  start-page: 281
  year: 1995
  ident: 10.1016/j.matchar.2023.112830_bb0170
  article-title: Effect of low earth orbit atomic oxygen on spacecraft materials
  publication-title: J. Mater. Sci.
  doi: 10.1007/BF00354389
  contributor:
    fullname: Reddy
– volume: 192
  year: 2020
  ident: 10.1016/j.matchar.2023.112830_bb0015
  article-title: New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints
  publication-title: Mater. Des.
  doi: 10.1016/j.matdes.2020.108726
  contributor:
    fullname: Zhang
– volume: 89
  start-page: 133
  year: 2015
  ident: 10.1016/j.matchar.2023.112830_bb0080
  article-title: Ultra thermal stability of LED die-attach achieved by pressureless ag stress-migration bonding at low temperature
  publication-title: Acta Mater.
  doi: 10.1016/j.actamat.2015.02.011
  contributor:
    fullname: Kunimune
– volume: 21
  start-page: 449
  year: 2003
  ident: 10.1016/j.matchar.2023.112830_bb0065
  article-title: Room temperature Cu-Cu direct bonding using surface activated bonding method
  publication-title: J. Vac. Sci. Technol. A
  doi: 10.1116/1.1537716
  contributor:
    fullname: Kim
– volume: 3
  start-page: 3838
  year: 2001
  ident: 10.1016/j.matchar.2023.112830_bb0125
  article-title: The thermal decomposition of silver (I, III) oxide: a combined XRD, FT-IR and Raman spectroscopic study
  publication-title: Phys. Chem. Chem. Phys.
  doi: 10.1039/b103226g
  contributor:
    fullname: Waterhouse
– volume: 158
  start-page: 81
  year: 2011
  ident: 10.1016/j.matchar.2023.112830_bb0035
  article-title: An overview of patterned metal/dielectric surface bonding: mechanism, alignment and characterization
  publication-title: J. Electrochem. Soc.
  doi: 10.1149/1.3577596
  contributor:
    fullname: Di Cioccio
– volume: 13
  start-page: 363
  year: 1989
  ident: 10.1016/j.matchar.2023.112830_bb0175
  article-title: The oxidation of silver by atomic oxygen
  publication-title: ESA J.
  contributor:
    fullname: Derooij
– volume: 576
  year: 2022
  ident: 10.1016/j.matchar.2023.112830_bb0090
  article-title: Direct metal bonding using nanotwinned Ag films with (111) surface orientation under air atmosphere for heterogeneous integration
  publication-title: Appl. Surf. Sci.
  doi: 10.1016/j.apsusc.2021.151845
  contributor:
    fullname: Chang
– volume: 274
  year: 2021
  ident: 10.1016/j.matchar.2023.112830_bb0085
  article-title: Improvement of Ag films with highly (111) surface orientation for metal direct bonding technique: Nanotwinned structure and ion bombardment effect
  publication-title: Mater. Chem. Phys.
  doi: 10.1016/j.matchemphys.2021.125159
  contributor:
    fullname: Chang
– volume: 29
  year: 2018
  ident: 10.1016/j.matchar.2023.112830_bb0185
  article-title: Strong damping of the localized surface plasmon resonance of Ag nanoparticles by Ag2O
  publication-title: Nanotechnology
  doi: 10.1088/1361-6528/aac031
  contributor:
    fullname: Wu
– volume: 118
  start-page: 147
  year: 2015
  ident: 10.1016/j.matchar.2023.112830_bb0145
  article-title: Characterization of Cu2O and Cu2O–Ag2O thin films synthesized by plasma oxidation
  publication-title: Vacuum
  doi: 10.1016/j.vacuum.2015.02.010
  contributor:
    fullname: Wu
– volume: 134
  year: 2012
  ident: 10.1016/j.matchar.2023.112830_bb0075
  article-title: 40 μm copper-silver composite Flip-Chip interconnect technology using solid-state bonding
  publication-title: J. Electron. Packag.
  doi: 10.1115/1.4006705
  contributor:
    fullname: Sha
– start-page: 351
  year: 2004
  ident: 10.1016/j.matchar.2023.112830_bb0205
  contributor:
    fullname: Zheludkevich
– volume: 117
  start-page: 146
  year: 2016
  ident: 10.1016/j.matchar.2023.112830_bb0025
  article-title: Scaling effect of interfacial reaction on intermetallic compound formation in Sn/cu pillar down to 1 μm diameter
  publication-title: Acta Mater.
  doi: 10.1016/j.actamat.2016.07.004
  contributor:
    fullname: Liu
– volume: 194
  year: 2021
  ident: 10.1016/j.matchar.2023.112830_bb0050
  article-title: Low temperature VECSEL-to-diamond heterogeneous integration with ag-in Spinodal nanostructured layer
  publication-title: Scr. Mater.
  doi: 10.1016/j.scriptamat.2020.11.013
  contributor:
    fullname: Sheikhi
– volume: 72
  start-page: 4025
  year: 2001
  ident: 10.1016/j.matchar.2023.112830_bb0165
  article-title: Satellite and rocket-borne atomic oxygen sensor techniques
  publication-title: Rev. Sci. Instrum.
  doi: 10.1063/1.1406928
  contributor:
    fullname: Osborne
– volume: 40
  start-page: 219
  year: 2015
  ident: 10.1016/j.matchar.2023.112830_bb0010
  article-title: Materials challenges in three-dimensional integrated circuits
  publication-title: MRS Bull.
  doi: 10.1557/mrs.2015.8
  contributor:
    fullname: Chen
– volume: 55
  start-page: 2617
  year: 1989
  ident: 10.1016/j.matchar.2023.112830_bb0195
  article-title: Grain boundary diffusion activation energy derived from surface roughness measurements of aluminum thin films
  publication-title: Appl. Phys. Lett.
  doi: 10.1063/1.102270
  contributor:
    fullname: Levenson
– volume: 86
  start-page: 46
  year: 2012
  ident: 10.1016/j.matchar.2023.112830_bb0020
  article-title: Anisotropic mechanical properties of Cu6Sn5 and (cu, Ni)(6)Sn-5
  publication-title: Mater. Lett.
  doi: 10.1016/j.matlet.2012.07.018
  contributor:
    fullname: Mu
– volume: 14
  start-page: 4554
  year: 2012
  ident: 10.1016/j.matchar.2023.112830_bb0120
  article-title: The silver-oxygen system in catalysis: new insights by near ambient pressure X-ray photoelectron spectroscopy
  publication-title: Phys. Chem. Chem. Phys.
  doi: 10.1039/c2cp22472k
  contributor:
    fullname: Rocha
– volume: 13
  start-page: 137
  year: 1992
  ident: 10.1016/j.matchar.2023.112830_bb0095
  article-title: The Ag-O (silver-oxygen) system
  publication-title: J. Phase Equilib.
  doi: 10.1007/BF02667476
  contributor:
    fullname: Karakaya
– volume: 702
  start-page: 398
  year: 2017
  ident: 10.1016/j.matchar.2023.112830_bb0105
  article-title: Low-temperature metal-to-alumina direct bonding process utilizing redox reaction between silver oxide and organic agent
  publication-title: Mater. Sci. Eng. A
  doi: 10.1016/j.msea.2017.07.034
  contributor:
    fullname: Asama
– volume: 60
  start-page: 1444
  year: 2013
  ident: 10.1016/j.matchar.2023.112830_bb0040
  article-title: Cu-cu bond quality enhancement through the inclusion of a hermetic seal for 3-D IC
  publication-title: IEEE Trans. Electron Dev.
  doi: 10.1109/TED.2013.2248368
  contributor:
    fullname: Peng
– volume: 79
  start-page: 676
  year: 1993
  ident: 10.1016/j.matchar.2023.112830_bb0180
  article-title: The oxidation of polycrystalline silver films by thermal, ground-state atomic oxygen
  publication-title: Nucl. Instrum. Methods Phys. Res., Sect. B
  doi: 10.1016/0168-583X(93)95441-7
  contributor:
    fullname: Edwards
– volume: 12
  start-page: 699
  year: 1994
  ident: 10.1016/j.matchar.2023.112830_bb0150
  article-title: Chemical and morphological changes on silver surfaces produced by microwave generated atomic oxygen
  publication-title: J. Vac. Sci. Technol. A
  doi: 10.1116/1.578855
  contributor:
    fullname: Bhan
– volume: 5
  start-page: 09734
  year: 2015
  ident: 10.1016/j.matchar.2023.112830_bb0070
  article-title: Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned cu
  publication-title: Sci. Rep.
  doi: 10.1038/srep09734
  contributor:
    fullname: Liu
– volume: 19
  start-page: 203
  year: 2003
  ident: 10.1016/j.matchar.2023.112830_bb0155
  article-title: Synthesis of silver oxide nano-scale thin films and photo-activated dynamic luminescence from their nanoparticles
  publication-title: Acta Physicochim.
  contributor:
    fullname: Zhang
– volume: 4 th, Toulouse
  start-page: 453
  year: 1989
  ident: 10.1016/j.matchar.2023.112830_bb0200
  article-title: An approach to long term prediction of the atomic oxygen effect on materials, in. European symposium on spacecraft materials in space
  publication-title: Environment
  contributor:
    fullname: Rooij
– volume: 34
  start-page: 9
  year: 2015
  ident: 10.1016/j.matchar.2023.112830_bb0055
  article-title: Developments of copper-to-copper low temperature bonding technology for 3D packaging
  publication-title: Electron. Compon. Mater.
  contributor:
    fullname: Li
– volume: 52
  start-page: 302
  year: 2012
  ident: 10.1016/j.matchar.2023.112830_bb0060
  article-title: Low temperature bonding technology for 3D integration
  publication-title: Microelectron. Reliab.
  doi: 10.1016/j.microrel.2011.03.038
  contributor:
    fullname: Ko
– volume: 27
  start-page: 2201
  year: 2016
  ident: 10.1016/j.matchar.2023.112830_bb0030
  article-title: The formation and conversion of intermetallic compounds in the cu pillar Sn-ag micro-bump with ENEPIG cu substrate under current stressing
  publication-title: J. Mater. Sci. Mater. Electron.
  doi: 10.1007/s10854-015-4011-2
  contributor:
    fullname: Hsiao
– volume: 121
  start-page: 19497
  year: 2017
  ident: 10.1016/j.matchar.2023.112830_bb0135
  article-title: Kirkendall effect vs corrosion of silver nanocrystals by atomic oxygen: from solid metal silver to Nanoporous silver oxide
  publication-title: J. Phys. Chem. C
  doi: 10.1021/acs.jpcc.7b06030
  contributor:
    fullname: El Mel
– volume: 61
  start-page: 39
  year: 2004
  ident: 10.1016/j.matchar.2023.112830_bb0115
  article-title: Oxidation of silver by atomic oxygen
  publication-title: Oxid. Met.
  doi: 10.1023/B:OXID.0000016275.96500.24
  contributor:
    fullname: Zheludkevich
– volume: 128
  start-page: 41
  year: 2017
  ident: 10.1016/j.matchar.2023.112830_bb0140
  article-title: Analytical approach for describing the collapse of surface asperities under compressive stress during rapid solidstate bonding
  publication-title: Scr. Mater.
  doi: 10.1016/j.scriptamat.2016.10.015
  contributor:
    fullname: Chen
– volume: 19
  start-page: 41
  year: 2017
  ident: 10.1016/j.matchar.2023.112830_bb0005
  article-title: The end of Moore’s law: a new beginning for information technology
  publication-title: Comput. Sci. Eng.
  doi: 10.1109/MCSE.2017.29
  contributor:
    fullname: Theis
– volume: 4
  start-page: 417
  year: 2018
  ident: 10.1016/j.matchar.2023.112830_bb0110
  article-title: Direct Ag-Ag bonding by in-situ reduction of surface oxides for advanced chip-package interconnection
  publication-title: Materialia
  doi: 10.1016/j.mtla.2018.10.017
  contributor:
    fullname: Wu
– volume: 315-318
  year: 2007
  ident: 10.1016/j.matchar.2023.112830_bb0045
  article-title: Cu-Cu bonding alternative to solder based micro-bumping
  contributor:
    fullname: Ruythooren
– volume: 49
  start-page: 2875
  year: 2008
  ident: 10.1016/j.matchar.2023.112830_bb0100
  article-title: Bonding technique using Micro-scaled silver-oxide particles for in-situ formation of silver nanoparticles
  publication-title: Mater. Trans.
  doi: 10.2320/matertrans.MRA2008269
  contributor:
    fullname: Morita
– volume: 8
  start-page: 141
  year: 2016
  ident: 10.1016/j.matchar.2023.112830_bb0130
  article-title: Creating nanoporosity in silver nanocolumns by direct exposure to radio-frequency air plasma
  publication-title: Nanoscale
  doi: 10.1039/C5NR07145C
  contributor:
    fullname: El Mel
– volume: 182
  start-page: 417
  year: 1999
  ident: 10.1016/j.matchar.2023.112830_bb0190
  article-title: The correlation of subsurface oxygen diffusion with variations of silver morphology in the silver–oxygen system
  publication-title: J. Catal.
  doi: 10.1006/jcat.1998.2388
  contributor:
    fullname: Nagy
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Snippet For microelectronics packaging, we have previously invented a novel solid-state bonding technology by using in-situ self-reduction process of surface-state...
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StartPage 112830
SubjectTerms Growth mechanism
Microelectronics packaging
Morphological transformation
Plasma-induced oxidation
Surface-state silver oxide
Title Plasma-induced growth mechanism of surface-state silver oxide in nanoscale for low-temperature bonding technology
URI https://dx.doi.org/10.1016/j.matchar.2023.112830
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