Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages

• Published in: Microelectronics and reliability Vol. 43; no. 5; pp. 803 - 809
• Main Authors: Lin, T.Y., Davison, K.L., Leong, W.S., Chua, Simon, Yao, Y.F., Pan, J.S., Chai, J.W., Toh, K.C., Tjiu, W.C.
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.05.2003

Strong bond between gold wire and silver-plated leadframe is significantly crucial for maintaining either bondability or reliability during integrated circuit (IC) manufacturing process and IC application in the fields. This study investigated the surface and grain structure of the silver-plated fil...