Specimen Size Effect of Interface Strength Distribution Induced by Grain Structure of Cu Line - SUZUKI, Toshiaki; OMIYA, Masaki; NAKAMURA, Tomoji; CHEN, Chuantong; SHISHIDO, Nobuyuki; SUZUKI, Takashi; KOIWA, Kozo; KAMIYA, Shoji; SATO, Hisashi; NOKUO, Takeshi; NISHIDA, Masahiro (TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A, 2013)
Keywords: Cu Grain; Local Interface Adhesion Strength; LSI Interconnect; Specimen Size Effect