SUZUKI, T., OMIYA, M., NAKAMURA, T., CHEN, C., SHISHIDO, N., SUZUKI, T., . . . NISHIDA, M. (2013). Specimen Size Effect of Interface Strength Distribution Induced by Grain Structure of Cu Line. TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A, 79(799), 354-358. https://doi.org/10.1299/kikaia.79.354
Chicago Style (17th ed.) CitationSUZUKI, Toshiaki, et al. "Specimen Size Effect of Interface Strength Distribution Induced by Grain Structure of Cu Line." TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A 79, no. 799 (2013): 354-358. https://doi.org/10.1299/kikaia.79.354.
MLA (9th ed.) CitationSUZUKI, Toshiaki, et al. "Specimen Size Effect of Interface Strength Distribution Induced by Grain Structure of Cu Line." TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A, vol. 79, no. 799, 2013, pp. 354-358, https://doi.org/10.1299/kikaia.79.354.