Coin silver as a construction material in low-temperature experiments
The utility of an alloy of 10% copper in silver (coin silver) as a construction material in certain low temperature experiments is discussed. While possessing thermal and electrical conductivities between copper and brass in zero magnetic field, this easily machined alloy has much less magneto-resis...
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| Published in | Physica B + C Vol. 107; no. 1; pp. 605 - 606 |
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| Main Author | |
| Format | Journal Article |
| Language | English |
| Published |
Elsevier B.V
01.01.1981
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| Online Access | Get full text |
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| Abstract | The utility of an alloy of 10% copper in silver (coin silver) as a construction material in certain low temperature experiments is discussed. While possessing thermal and electrical conductivities between copper and brass in zero magnetic field, this easily machined alloy has much less magneto-resistance and 10% of the magnetic specific heat of copper. Moreoevr, it is relativily resistant to creep under mechanical stress. A table of the low-temperature properties of coin silver is presented which includes the results of direct measurements of its magneto-thermal conductivity below 500 mK. |
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| AbstractList | The utility of an alloy of 10% copper in silver (coin silver) as a construction material in certain low temperature experiments is discussed. While possessing thermal and electrical conductivities between copper and brass in zero magnetic field, this easily machined alloy has much less magneto-resistance and 10% of the magnetic specific heat of copper. Moreoevr, it is relativily resistant to creep under mechanical stress. A table of the low-temperature properties of coin silver is presented which includes the results of direct measurements of its magneto-thermal conductivity below 500 mK. |
| Author | Van Degrift, Craig T. |
| Author_xml | – sequence: 1 givenname: Craig T. surname: Van Degrift fullname: Van Degrift, Craig T. organization: Temperature & Pressure Measurements and Standard Division, Center for Absolute Physical Quantities, National Bureau of Standards, Washington, D.C. 20234, USA |
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| CitedBy_id | crossref_primary_10_1103_PhysRevLett_77_322 crossref_primary_10_1016_S0011_2275_01_00127_8 crossref_primary_10_1063_1_3520482 |
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| Copyright | 1981 |
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| References | Van Degrift, Bowers, Wildes, Pipes (BIB2) 1980; 19 BIB1 Kittel (BIB4) 1963 D. D. Osheroff (private communication) is testing silver-silicon alloys and has used coin silver parts at ultra-low temperatures. BIB5 BIB3 Kittel (10.1016/0378-4363(81)90605-7_BIB4) 1963 Van Degrift (10.1016/0378-4363(81)90605-7_BIB2_1) 1980; 19 10.1016/0378-4363(81)90605-7_BIB6 |
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| Title | Coin silver as a construction material in low-temperature experiments |
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