Quasi-static analysis of microstrip lines with variation of substrate thickness in transverse direction

• Published in: International journal of RF and microwave computer-aided engineering Vol. 13; no. 3; pp. 194 - 205
• Main Authors: Khoulji, S., Essaaidi, M.
• Format: Journal Article
• Language: English
• Published: New York Wiley Subscription Services, Inc., A Wiley Company 01.05.2003
• Subjects: finite metallization thickness; losses; method of lines; microstrip lines; quasi-static analysis; substrates with arbitrarily varying thickness

This article is devoted to the analysis of microstrip lines printed on dielectric substrates with transversely varying thickness using the quasi‐static approximation and the method of lines. Discretization lines of varying length, according to the layer thickness, are used and only the Laplace wave...