Study of pseudo soldering based on eddy current pulsed thermography

• Published in: Applied physics letters Vol. 111; no. 11
• Main Authors: Zhou, Xiuyun, Xue, Yun, Chen, Yaqiu, Lu, Xiaochuan, Liu, Zhen
• Format: Journal Article
• Language: English
• Published: 11.09.2017

Pseudo soldering defects can break the electrical and mechanical connection between components and the print circuit board and eventually cause failure of the whole electronic equipment. In this letter, the eddy current pulsed thermography (ECPT) method was used for defect inspection of small-sized...