Study of pseudo soldering based on eddy current pulsed thermography
Pseudo soldering defects can break the electrical and mechanical connection between components and the print circuit board and eventually cause failure of the whole electronic equipment. In this letter, the eddy current pulsed thermography (ECPT) method was used for defect inspection of small-sized...
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| Published in | Applied physics letters Vol. 111; no. 11 |
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| Main Authors | , , , , |
| Format | Journal Article |
| Language | English |
| Published |
11.09.2017
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| Online Access | Get full text |
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| Abstract | Pseudo soldering defects can break the electrical and mechanical connection between components and the print circuit board and eventually cause failure of the whole electronic equipment. In this letter, the eddy current pulsed thermography (ECPT) method was used for defect inspection of small-sized solder joints. The identification of defects of solder joints is based on the heat transfer between various component structures. The experimental results indicated that the ECPT method can be effectively used for defect detection and location of the solder joints. In addition, it can distinguish different degrees of pseudo soldering. |
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| AbstractList | Pseudo soldering defects can break the electrical and mechanical connection between components and the print circuit board and eventually cause failure of the whole electronic equipment. In this letter, the eddy current pulsed thermography (ECPT) method was used for defect inspection of small-sized solder joints. The identification of defects of solder joints is based on the heat transfer between various component structures. The experimental results indicated that the ECPT method can be effectively used for defect detection and location of the solder joints. In addition, it can distinguish different degrees of pseudo soldering. |
| Author | Chen, Yaqiu Zhou, Xiuyun Xue, Yun Liu, Zhen Lu, Xiaochuan |
| Author_xml | – sequence: 1 givenname: Xiuyun surname: Zhou fullname: Zhou, Xiuyun organization: School of Automation Engineering, University of Electronic Science and Technology of China, Chengdu, China – sequence: 2 givenname: Yun surname: Xue fullname: Xue, Yun email: xueyunmail@163.com organization: School of Automation Engineering, University of Electronic Science and Technology of China, Chengdu, China – sequence: 3 givenname: Yaqiu surname: Chen fullname: Chen, Yaqiu organization: School of Automation Engineering, University of Electronic Science and Technology of China, Chengdu, China – sequence: 4 givenname: Xiaochuan surname: Lu fullname: Lu, Xiaochuan organization: School of Automation Engineering, University of Electronic Science and Technology of China, Chengdu, China – sequence: 5 givenname: Zhen surname: Liu fullname: Liu, Zhen organization: School of Automation Engineering, University of Electronic Science and Technology of China, Chengdu, China |
| BookMark | eNqdkM9LwzAcxYNMsJse_A9yVeiWb9OmyVGGv2DgQT2XND-2SteUJBX639uxiSCePD3e4_Pe4c3RrHOdQegayBIIoytY5kIwyrIzlAApy5QC8BlKCCE0ZaKACzQP4WOyRUZpgtavcdAjdhb3wQza4eBabXzTbXEtg9HYddjoiVCD96aLuB_aQxx3xu_d1st-N16icyun9OqkC_T-cP-2fko3L4_P67tNqjIhYlpKXnNWKsmYLIBTm0tBdJFzroGxTBWlKiXQnFkrlKo15wQmVUrWRDNl6QKtjrvKuxC8sZVqooyN66KXTVsBqQ4fVFCdPpgaN78avW_20o9_srdHNnyv_g_-dP4HrHpt6Reu-Hr5 |
| CODEN | APPLAB |
| CitedBy_id | crossref_primary_10_3390_app14167269 crossref_primary_10_1063_1_5003674 |
| Cites_doi | 10.1016/j.applthermaleng.2011.12.028 10.1063/1.4756211 10.1063/1.4790866 10.1109/TII.2015.2492924 10.3390/s151025882 10.1109/TIE.2016.2574987 10.1016/j.compstruct.2010.10.017 10.1063/1.4922524 10.1109/TPEL.2013.2288334 10.1063/1.4828889 10.1016/j.compstruct.2013.10.049 10.1063/1.4884644 10.1063/1.4864045 |
| ContentType | Journal Article |
| Copyright | Author(s) |
| Copyright_xml | – notice: Author(s) |
| DBID | AAYXX CITATION |
| DOI | 10.1063/1.4996362 |
| DatabaseName | CrossRef |
| DatabaseTitle | CrossRef |
| DatabaseTitleList | CrossRef |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Engineering Physics |
| EISSN | 1077-3118 |
| ExternalDocumentID | 10_1063_1_4996362 apl |
| GrantInformation_xml | – fundername: National Natural Science Foundation of China (NSFC) grantid: 61271035 funderid: http://dx.doi.org/10.13039/501100001809 |
| GroupedDBID | -DZ -~X .DC 1UP 2-P 23M 4.4 53G 5GY 5VS 6J9 A9. AAAAW AABDS AAEUA AAGZG AAPUP AAYIH ABFTF ABJNI ABRJW ABZEH ACBEA ACBRY ACGFO ACGFS ACLYJ ACNCT ACZLF ADCTM AEGXH AEJMO AENEX AFATG AFHCQ AGKCL AGLKD AGMXG AGTJO AHSDT AIAGR AJJCW AJQPL ALEPV ALMA_UNASSIGNED_HOLDINGS AQWKA ATXIE AWQPM BPZLN CS3 D0L EBS EJD ESX F.2 F5P FDOHQ FFFMQ HAM M6X M71 M73 N9A NPSNA O-B P2P RIP RNS RQS SJN TAE TN5 UCJ UPT WH7 XJE YZZ ~02 AAGWI AAYXX ABJGX ADMLS BDMKI CITATION |
| ID | FETCH-LOGICAL-c299t-7a8b867ca66a5183f4a90d5488d1662c57c7a1346ff9ccbd8801ccbccab0d6cf3 |
| ISSN | 0003-6951 |
| IngestDate | Thu Apr 24 23:03:00 EDT 2025 Tue Jul 01 01:15:53 EDT 2025 Sun Jul 14 10:06:03 EDT 2019 Fri Jun 21 00:14:31 EDT 2024 |
| IsPeerReviewed | true |
| IsScholarly | true |
| Issue | 11 |
| Language | English |
| License | 0003-6951/2017/111(11)/114104/5/$30.00 Published by AIP Publishing. |
| LinkModel | OpenURL |
| MergedId | FETCHMERGED-LOGICAL-c299t-7a8b867ca66a5183f4a90d5488d1662c57c7a1346ff9ccbd8801ccbccab0d6cf3 |
| PageCount | 5 |
| ParticipantIDs | crossref_citationtrail_10_1063_1_4996362 crossref_primary_10_1063_1_4996362 scitation_primary_10_1063_1_4996362 |
| ProviderPackageCode | CITATION AAYXX |
| PublicationCentury | 2000 |
| PublicationDate | 20170911 2017-09-11 |
| PublicationDateYYYYMMDD | 2017-09-11 |
| PublicationDate_xml | – month: 09 year: 2017 text: 20170911 day: 11 |
| PublicationDecade | 2010 |
| PublicationTitle | Applied physics letters |
| PublicationYear | 2017 |
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| SSID | ssj0005233 |
| Score | 2.2470052 |
| Snippet | Pseudo soldering defects can break the electrical and mechanical connection between components and the print circuit board and eventually cause failure of the... |
| SourceID | crossref scitation |
| SourceType | Enrichment Source Index Database Publisher |
| Title | Study of pseudo soldering based on eddy current pulsed thermography |
| URI | http://dx.doi.org/10.1063/1.4996362 |
| Volume | 111 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV3fS90wFA6bMuYeZHMbuk0J2x4Gl7qbmzZpH-WqiOgYqHDdS0nzA4XrbdWbwfzrPWmTtpf5oL60JaS5l_Olp985zfmC0HdDNUzdjEQk1iaKeZpFWSJIlLBUcs3JqFDui-7xL3ZwFh9Okkm3X15dXTIvtuXdg3Ulz0EV2gBXVyX7BGTbQaEBrgFfOALCcHwUxidBEbq61VaVA_g1VUsLDtzLSbkPAVpBD-lFmCo7dc2O8131paqDCq1npE2243YwrUt9WtL956K0DpHJpf1n2zk1sXVK9LxrGfuCj3NxfWlD45G_VZTywvoZ6ZMN8AJzmyWQBQdKI5Z5jVjd-Mwhd6lO70aDU-3usqGy5D9vDfTIJQ62Iepi1DvlRfFrUU1fouURhADgw5Z3do-PTnoLeCgN-yG6vxR0oxj92Q65wDZeA6lo1jf0KMTpW7TquT_eaYB8h17o2Rp601OEXEOvfje2f4_GNbi4NLgBF7fg4hpcXM6wAxd7cHEDLu6D-wGd7e-djg8iv-NFJIEWzCMu0iJlXArGRALO1sQiGyoIKlNFGBvJhEsuCI2ZMZmU8BgBv4AzPIXFUDFp6Ee0NCtneh1hIhmTFALWRGdAuoeFjEdSUpMyzRkE1RvoR7BMHszidiWZ5vWyBEZzknsjbqCvbdeq0UB5qNO31rxP7PW3vOl65JUynx411me00k3RL2hpfmP1JjDEebHlp8o9jPRm5g |
| linkProvider | EBSCOhost |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Study+of+pseudo+soldering+based+on+eddy+current+pulsed+thermography&rft.jtitle=Applied+physics+letters&rft.au=Zhou%2C+Xiuyun&rft.au=Xue%2C+Yun&rft.au=Chen%2C+Yaqiu&rft.au=Lu%2C+Xiaochuan&rft.date=2017-09-11&rft.issn=0003-6951&rft.eissn=1077-3118&rft.volume=111&rft.issue=11&rft_id=info:doi/10.1063%2F1.4996362&rft.externalDocID=apl |
| thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0003-6951&client=summon |
| thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0003-6951&client=summon |
| thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0003-6951&client=summon |