Advances in Contactless Silicon Defect and Impurity Diagnostics Based on Lifetime Spectroscopy and Infrared Imaging
This paper gives a review of some recent developments in the field of contactless silicon wafer characterization techniques based on lifetime spectroscopy and infrared imaging. In the first part of the contribution, we outline the status of different lifetime spectroscopy approaches suitable for the...
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Published in | Advances in OptoElectronics (Hindawi) Vol. 2007; pp. 1 - 9 |
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Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
01.01.2007
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Abstract | This paper gives a review of some recent developments in the field of contactless silicon wafer
characterization techniques based on lifetime spectroscopy and infrared imaging. In the first part of the
contribution, we outline the status of different lifetime spectroscopy approaches suitable for the
identification of impurities in silicon and discuss—in more detail—the technique of temperature- and
injection-dependent lifetime spectroscopy. The second part of the paper focuses on the application
of infrared cameras to analyze spatial inhomogeneities in silicon wafers. By measuring the infrared
signal absorbed or emitted from light-generated free excess carriers, high-resolution recombination
lifetime mappings can be generated within seconds to minutes. In addition, mappings of
non-recombination-active trapping centers can be deduced from injection-dependent infrared lifetime
images. The trap density has been demonstrated to be an important additional parameter in the
characterization and assessment of solar-grade multicrystalline silicon wafers, as areas of increased
trap density tend to deteriorate during solar cell processing. |
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AbstractList | This paper gives a review of some recent developments in the field of contactless silicon wafer characterization techniques based on lifetime spectroscopy and infrared imaging. In the first part of the contribution, we outline the status of different lifetime spectroscopy approaches suitable for the identification of impurities in silicon and discuss-in more detail-the technique of temperature- and injection-dependent lifetime spectroscopy. The second part of the paper focuses on the application of infrared cameras to analyze spatial inhomogeneities in silicon wafers. By measuring the infrared signal absorbed or emitted from light-generated free excess carriers, high-resolution recombination lifetime mappings can be generated within seconds to minutes. In addition, mappings of non-recombination-active trapping centers can be deduced from injection-dependent infrared lifetime images. The trap density has been demonstrated to be an important additional parameter in the characterization and assessment of solar-grade multicrystalline silicon wafers, as areas of increased trap density tend to deteriorate during solar cell processing. This paper gives a review of some recent developments in the field of contactless silicon wafer characterization techniques based on lifetime spectroscopy and infrared imaging. In the first part of the contribution, we outline the status of different lifetime spectroscopy approaches suitable for the identification of impurities in silicon and discuss—in more detail—the technique of temperature- and injection-dependent lifetime spectroscopy. The second part of the paper focuses on the application of infrared cameras to analyze spatial inhomogeneities in silicon wafers. By measuring the infrared signal absorbed or emitted from light-generated free excess carriers, high-resolution recombination lifetime mappings can be generated within seconds to minutes. In addition, mappings of non-recombination-active trapping centers can be deduced from injection-dependent infrared lifetime images. The trap density has been demonstrated to be an important additional parameter in the characterization and assessment of solar-grade multicrystalline silicon wafers, as areas of increased trap density tend to deteriorate during solar cell processing. |
Author | Bothe, Karsten Brendel, Rolf Schmidt, Jan Pohl, Peter |
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Cites_doi | 10.1063/1.371186 10.1063/1.364403 10.1002/pip.547 10.1063/1.1483908 10.1103/PhysRev.87.835 10.1063/1.2234747 10.1063/1.1722229 10.1109/T-ED.1978.19066 10.1063/1.358677 10.1002/pssa.200564510 10.1063/1.1563830 10.1063/1.1428095 10.1063/1.2077833 10.1063/1.337612 10.1063/1.1663719 10.1063/1.348570 10.1063/1.2713933 10.1103/PhysRev.87.387 10.1063/1.123663 10.1063/1.115936 10.1103/PhysRev.97.311 |
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characterization techniques based on lifetime spectroscopy and... This paper gives a review of some recent developments in the field of contactless silicon wafer characterization techniques based on lifetime spectroscopy and... |
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