Effects of cooler materials on cooling performance of ATCA mainboards
Nowadays, the rapid increase in CPU heat generation has become a very serious problem for the whole processing system, especially a system with more than one CPU. In this paper, based upon the cooling design requirements of ATCA processing systems, a series of investigations were conducted to explor...
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| Published in | Heat transfer, Asian research Vol. 38; no. 1; pp. 51 - 56 |
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| Main Authors | , , , |
| Format | Journal Article |
| Language | English |
| Published |
Hoboken
Wiley Subscription Services, Inc., A Wiley Company
01.01.2009
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| Subjects | |
| Online Access | Get full text |
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| Abstract | Nowadays, the rapid increase in CPU heat generation has become a very serious problem for the whole processing system, especially a system with more than one CPU. In this paper, based upon the cooling design requirements of ATCA processing systems, a series of investigations were conducted to explore the effects of different cooling materials such as copper or aluminum on the cooling performance of the whole system. Meanwhile, several ways of improving the cooling performance are provided in the paper. © 2008 Wiley Periodicals, Inc. Heat Trans Asian Res; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/htj.20230 |
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| AbstractList | Abstract
Nowadays, the rapid increase in CPU heat generation has become a very serious problem for the whole processing system, especially a system with more than one CPU. In this paper, based upon the cooling design requirements of ATCA processing systems, a series of investigations were conducted to explore the effects of different cooling materials such as copper or aluminum on the cooling performance of the whole system. Meanwhile, several ways of improving the cooling performance are provided in the paper. © 2008 Wiley Periodicals, Inc. Heat Trans Asian Res; Published online in Wiley InterScience (
www.interscience.wiley.com
). DOI 10.1002/htj.20230 Nowadays, the rapid increase in CPU heat generation has become a very serious problem for the whole processing system, especially a system with more than one CPU. In this paper, based upon the cooling design requirements of ATCA processing systems, a series of investigations were conducted to explore the effects of different cooling materials such as copper or aluminum on the cooling performance of the whole system. Meanwhile, several ways of improving the cooling performance are provided in the paper. © 2008 Wiley Periodicals, Inc. Heat Trans Asian Res; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/htj.20230 Nowadays, the rapid increase in CPU heat generation has become a very serious problem for the whole processing system, especially a system with more than one CPU. In this paper, based upon the cooling design requirements of ATCA processing systems, a series of investigations were conducted to explore the effects of different cooling materials such as copper or aluminum on the cooling performance of the whole system. Meanwhile, several ways of improving the cooling performance are provided in the paper. |
| Author | Meng, Meng Dong, Zhizhong Liang, Zhanpeng Peng, Xiaofeng |
| Author_xml | – sequence: 1 givenname: Zhizhong surname: Dong fullname: Dong, Zhizhong organization: Laboratory of Phase Change and Interfacial Transport Phenomena, Department of Thermal Engineering, Tsinghua University, Beijing 100084, China – sequence: 2 givenname: Meng surname: Meng fullname: Meng, Meng organization: Laboratory of Phase Change and Interfacial Transport Phenomena, Department of Thermal Engineering, Tsinghua University, Beijing 100084, China – sequence: 3 givenname: Zhanpeng surname: Liang fullname: Liang, Zhanpeng organization: Laboratory of Phase Change and Interfacial Transport Phenomena, Department of Thermal Engineering, Tsinghua University, Beijing 100084, China – sequence: 4 givenname: Xiaofeng surname: Peng fullname: Peng, Xiaofeng organization: Laboratory of Phase Change and Interfacial Transport Phenomena, Department of Thermal Engineering, Tsinghua University, Beijing 100084, China |
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| References | Zeng L, Chen W, Xie S, Yang B. The development and heat dispersion problem in integrate circuit packaging. Electronics and Packaging 2006;6:15- 21. Yang S, Tao W. Heat transfer. Higher Education Press; 1998. pp 20-202. Zhou J, Yang C. Design and thermal analysis of CPU heat sink. Electro-Mech Eng 2006;22:16- 18. 1998 2006; 6 2006; 22 Zhou J (e_1_2_1_2_2) 2006; 22 e_1_2_1_4_2 e_1_2_1_5_2 Yang S (e_1_2_1_6_2) 1998 Zeng L (e_1_2_1_3_2) 2006; 6 |
| References_xml | – volume: 22 start-page: 16 year: 2006 end-page: 18 article-title: Design and thermal analysis of CPU heat sink publication-title: Electro‐Mech Eng – start-page: 20 year: 1998 end-page: 202 – volume: 6 start-page: 15 year: 2006 end-page: 21 article-title: The development and heat dispersion problem in integrate circuit packaging publication-title: Electronics and Packaging – start-page: 20 volume-title: Heat transfer year: 1998 ident: e_1_2_1_6_2 contributor: fullname: Yang S – volume: 22 start-page: 16 year: 2006 ident: e_1_2_1_2_2 article-title: Design and thermal analysis of CPU heat sink publication-title: Electro‐Mech Eng contributor: fullname: Zhou J – volume: 6 start-page: 15 year: 2006 ident: e_1_2_1_3_2 article-title: The development and heat dispersion problem in integrate circuit packaging publication-title: Electronics and Packaging contributor: fullname: Zeng L – ident: e_1_2_1_5_2 – ident: e_1_2_1_4_2 |
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| Snippet | Nowadays, the rapid increase in CPU heat generation has become a very serious problem for the whole processing system, especially a system with more than one... Abstract Nowadays, the rapid increase in CPU heat generation has become a very serious problem for the whole processing system, especially a system with more... |
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| SubjectTerms | aluminum heat sink ATCA mainboard ATCA mainboard, cooler, copper heat sink, aluminum heat sink cooler copper heat sink |
| Title | Effects of cooler materials on cooling performance of ATCA mainboards |
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