Simultaneous enhancement of the bandwidth and responsivity in high-speed avalanche photodiodes with an optimized flip-chip bonding package

• Published in: Optics express Vol. 31; no. 16; p. 26463
• Main Authors: Naseem, Chen, Nan-Wei, Parvez, Syed Hasan, Ahmad, Zohauddin, Yang, Sean, Chen, H-S, Chang, Hsiang-Szu, Huang, Jack Jia-Sheng, Shi, Jin-Wei
• Format: Journal Article
• Language: English
• Published: 31.07.2023

The enhancement in responsivity of photodiodes (PDs) or avalanche photodiodes (APDs) with the traditional flip-chip bonding package usually comes at the expense of degradation in the optical-to-electrical (O-E) bandwidth due to the increase of parasitic capacitance. In this work, we demonstrate back...