A Real-Time Adaptive IGBT Thermal Model Based on an Effective Heat Propagation Path Concept

• Published in: IEEE journal of emerging and selected topics in power electronics Vol. 9; no. 4; pp. 3936 - 3946
• Main Authors: Wang, Ze, Qiao, Wei, Qu, Liyan
• Format: Journal Article
• Language: English
• Published: Piscataway IEEE 01.08.2021; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Adaptation models; Adaptive thermal model; Aging; Cracks; effective heat propagation path (EHPP); Equivalent circuits; Heat; Heating systems; Insulated gate bipolar transistors; insulated-gate bipolar transistor (IGBT); Junctions; Modules; Nonuniformity; Propagation; Real time; Semiconductor devices; solder aging; Solders; Substrates; Temperature distribution; Temperature measurement; Thermal analysis; Thermodynamic properties; Time measurement
• ISSN: 2168-6777; 2168-6785
• DOI: 10.1109/JESTPE.2020.2973181

The information of junction temperature is crucial for the operational management of insulated-gate bipolar transistor (IGBT) modules. In practice, the junction temperature is typically estimated by using an electrothermal model. IGBT modules are subject to various aging processes during operation,...