Polyacrylamide/carboxymethyl chitosan double‐network hydrogels with high conductivity and mechanical toughness for flexible sensors

Conductive hydrogels are ideal candidate materials for flexible sensors, but the integration of satisfactory mechanical performances with high conductivity to meet the requirements for practical applications remains a challenge. Herein, a tough ionically conductive polyacrylamide (PAAm)/carboxymethy...

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Bibliographic Details
Published inJournal of applied polymer science Vol. 139; no. 16
Main Authors Zeng, Runpeng, Lu, Shuxin, Qi, Chuyi, Jin, Lele, Xu, Jinbao, Dong, Zhixian, Lei, Caihong
Format Journal Article
LanguageEnglish
Published Hoboken, USA John Wiley & Sons, Inc 20.04.2022
Wiley Subscription Services, Inc
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Summary:Conductive hydrogels are ideal candidate materials for flexible sensors, but the integration of satisfactory mechanical performances with high conductivity to meet the requirements for practical applications remains a challenge. Herein, a tough ionically conductive polyacrylamide (PAAm)/carboxymethyl chitosan (CMCs) double‐network (DN) hydrogel is fabricated via in situ polymerization of acrylamide in CMCs aqueous solution, followed by ferric chloride (FeCl3) solution immersing. The PAAm/CMCs‐Fe3+ DN hydrogel demonstrates satisfactory mechanical properties, including sufficient tensile strength (~440 kPa), prominent stretchability (~715%), high toughness (~1658 kJ m−3), and excellent fatigue resistance, as well as superb conductivity up to 3.1 S m−1. Moreover, the ionically conductive DN hydrogel‐based sensors exhibit high sensitivity in a broad strain window (0%–700%) and can accurately, and repeatedly monitor the motions of body joints, such as finger and wrist, exhibiting great potential in applications of flexible sensors.
Bibliography:Funding information
Runpeng Zeng and Shuxin Lu contributed equally to this work.
Guangdong Provincial Development and Reform Commission, Grant/Award Number: 841; National Natural Science Foundation of China, Grant/Award Number: 51603047
ISSN:0021-8995
1097-4628
DOI:10.1002/app.51993