Surface Spline Interpolation Method for Thermal Reconstruction with Limited Sensor Data of Non-Uniform Placements
With the characteristic size reducing as well as the power densities exponentially increasing, elevated chip temperatures are true limiters to the performance and reliability of integrated circuits. To address these thermal issues, it is essential to use a set of on-chip thermal sensors to monitor t...
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Published in | Shanghai jiao tong da xue xue bao Vol. 19; no. 1; pp. 65 - 71 |
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Main Author | |
Format | Journal Article |
Language | English |
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Berlin/Heidelberg
Springer Berlin Heidelberg
01.02.2014
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Online Access | Get full text |
ISSN | 1007-1172 1995-8188 |
DOI | 10.1007/s12204-013-1469-z |
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Abstract | With the characteristic size reducing as well as the power densities exponentially increasing, elevated chip temperatures are true limiters to the performance and reliability of integrated circuits. To address these thermal issues, it is essential to use a set of on-chip thermal sensors to monitor temperatures during operation. These temperature sampling results are then used by thermal management techniques to appropriately manage chip performance. In this paper, we propose a surface spline interpolation method to reconstruct the full thermal characterization of integrated circuits with non-uniform thermal sensor placements. We construct the thermal surface function using the mathematical tool of surface spline with the matrix calculation of the non-uniform sample data. Then, we take the coordinates of the points at grid locations into the surface function to get its temperature value so that we can reconstruct the full thermal signals. To evaluate the effectiveness of our method, we develop an experiment for reconstructing full thermal status of a 16-core processor. Experimental results show that our method outperforms the inverse distance weighting method based on dynamic Voronoi diagram and spectral analysis techniques both in the average absolute error metric and the hot spot absolute error metric with short enough runtime to meet the real-time process demand. Besides, our method still has the advantages such as its mathematical simplicity with no need of prehprocess. |
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AbstractList | With the characteristic size reducing as well as the power densities exponentially increasing, elevated chip temperatures are true limiters to the performance and reliability of integrated circuits. To address these thermal issues, it is essential to use a set of on-chip thermal sensors to monitor temperatures during operation. These temperature sampling results are then used by thermal management techniques to appropriately manage chip performance. In this paper, we propose a surface spline interpolation method to reconstruct the full thermal characterization of integrated circuits with non-uniform thermal sensor placements. We construct the thermal surface function using the mathematical tool of surface spline with the matrix calculation of the non-uniform sample data. Then, we take the coordinates of the points at grid locations into the surface function to get its temperature value so that we can reconstruct the full thermal signals. To evaluate the effectiveness of our method, we develop an experiment for reconstructing full thermal status of a 16-core processor. Experimental results show that our method outperforms the inverse distance weighting method based on dynamic Voronoi diagram and spectral analysis techniques both in the average absolute error metric and the hot spot absolute error metric with short enough runtime to meet the real-time process demand. Besides, our method still has the advantages such as its mathematical simplicity with no need of prehprocess. With the characteristic size reducing as well as the power densities exponentially increasing, elevated chip temperatures are true limiters to the performance and reliability of integrated circuits. To address these thermal issues, it is essential to use a set of on-chip thermal sensors to monitor temperatures during operation. These temperature sampling results are then used by thermal management techniques to appropriately manage chip performance. In this paper, we propose a surface spline interpolation method to reconstruct the full thermal characterization of integrated circuits with non-uniform thermal sensor placements. We construct the thermal surface function using the mathematical tool of surface spline with the matrix calculation of the non-uniform sample data. Then, we take the coordinates of the points at grid locations into the surface function to get its temperature value so that we can reconstruct the full thermal signals. To evaluate the effectiveness of our method, we develop an experiment for reconstructing full thermal status of a 16-core processor. Experimental results show that our method outperforms the inverse distance weighting method based on dynamic Voronoi diagram and spectral analysis techniques both in the average absolute error metric and the hot spot absolute error metric with short enough runtime to meet the real-time process demand. Besides, our method still has the advantages such as its mathematical simplicity with no need of pre-process. |
Author | 王若琳 李鑫 刘文江 刘涛 戎蒙恬 周亮 |
AuthorAffiliation | Key Laboratory of Ministry of Education of Design and Electromagnetic Compatibility" of High" Speed Electronic Systems, Shanghai Jiaotong University, Shanghai 200240, China |
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Cites_doi | 10.1016/S0098-3004(01)00005-X 10.1145/116873.116880 10.1145/1400112.1400114 10.2514/3.44330 10.1145/800186.810616 10.1587/transele.E94.C.1295 10.1109/TCAD.2008.915538 10.1145/1629911.1630038 10.1145/1837274.1837291 10.1145/1629911.1630037 10.1145/1629911.1630036 |
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Keywords | dynamic thermal management non-uniform surface spline thermal sensors TN 433 |
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Notes | 31-1943/U dynamic thermal management, surface spline, thermal sensors, non-uniform With the characteristic size reducing as well as the power densities exponentially increasing, elevated chip temperatures are true limiters to the performance and reliability of integrated circuits. To address these thermal issues, it is essential to use a set of on-chip thermal sensors to monitor temperatures during operation. These temperature sampling results are then used by thermal management techniques to appropriately manage chip performance. In this paper, we propose a surface spline interpolation method to reconstruct the full thermal characterization of integrated circuits with non-uniform thermal sensor placements. We construct the thermal surface function using the mathematical tool of surface spline with the matrix calculation of the non-uniform sample data. Then, we take the coordinates of the points at grid locations into the surface function to get its temperature value so that we can reconstruct the full thermal signals. To evaluate the effectiveness of our method, we develop an experiment for reconstructing full thermal status of a 16-core processor. Experimental results show that our method outperforms the inverse distance weighting method based on dynamic Voronoi diagram and spectral analysis techniques both in the average absolute error metric and the hot spot absolute error metric with short enough runtime to meet the real-time process demand. Besides, our method still has the advantages such as its mathematical simplicity with no need of prehprocess. WANG Ruo-lin , LI Xin , LIU Wen-jiang LIU Tao, RONG Meng-tian , ZHOU Liang ey Laboratory of Ministry of Education of Design and Electromagnetic Compatibility of High Speed Electronic Systems, Shanghai Jiaotong University, Shanghai 200240, China ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 ObjectType-Article-1 ObjectType-Feature-2 |
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SubjectTerms | Architecture Chips Computer Science Electrical Engineering Engineering Error analysis Functions (mathematics) Integrated circuits Life Sciences Materials Science Mathematical analysis Placement Sensors Splines |
Title | Surface Spline Interpolation Method for Thermal Reconstruction with Limited Sensor Data of Non-Uniform Placements |
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