Surface Spline Interpolation Method for Thermal Reconstruction with Limited Sensor Data of Non-Uniform Placements

With the characteristic size reducing as well as the power densities exponentially increasing, elevated chip temperatures are true limiters to the performance and reliability of integrated circuits. To address these thermal issues, it is essential to use a set of on-chip thermal sensors to monitor t...

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Published inShanghai jiao tong da xue xue bao Vol. 19; no. 1; pp. 65 - 71
Main Author 王若琳 李鑫 刘文江 刘涛 戎蒙恬 周亮
Format Journal Article
LanguageEnglish
Published Berlin/Heidelberg Springer Berlin Heidelberg 01.02.2014
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ISSN1007-1172
1995-8188
DOI10.1007/s12204-013-1469-z

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Abstract With the characteristic size reducing as well as the power densities exponentially increasing, elevated chip temperatures are true limiters to the performance and reliability of integrated circuits. To address these thermal issues, it is essential to use a set of on-chip thermal sensors to monitor temperatures during operation. These temperature sampling results are then used by thermal management techniques to appropriately manage chip performance. In this paper, we propose a surface spline interpolation method to reconstruct the full thermal characterization of integrated circuits with non-uniform thermal sensor placements. We construct the thermal surface function using the mathematical tool of surface spline with the matrix calculation of the non-uniform sample data. Then, we take the coordinates of the points at grid locations into the surface function to get its temperature value so that we can reconstruct the full thermal signals. To evaluate the effectiveness of our method, we develop an experiment for reconstructing full thermal status of a 16-core processor. Experimental results show that our method outperforms the inverse distance weighting method based on dynamic Voronoi diagram and spectral analysis techniques both in the average absolute error metric and the hot spot absolute error metric with short enough runtime to meet the real-time process demand. Besides, our method still has the advantages such as its mathematical simplicity with no need of prehprocess.
AbstractList With the characteristic size reducing as well as the power densities exponentially increasing, elevated chip temperatures are true limiters to the performance and reliability of integrated circuits. To address these thermal issues, it is essential to use a set of on-chip thermal sensors to monitor temperatures during operation. These temperature sampling results are then used by thermal management techniques to appropriately manage chip performance. In this paper, we propose a surface spline interpolation method to reconstruct the full thermal characterization of integrated circuits with non-uniform thermal sensor placements. We construct the thermal surface function using the mathematical tool of surface spline with the matrix calculation of the non-uniform sample data. Then, we take the coordinates of the points at grid locations into the surface function to get its temperature value so that we can reconstruct the full thermal signals. To evaluate the effectiveness of our method, we develop an experiment for reconstructing full thermal status of a 16-core processor. Experimental results show that our method outperforms the inverse distance weighting method based on dynamic Voronoi diagram and spectral analysis techniques both in the average absolute error metric and the hot spot absolute error metric with short enough runtime to meet the real-time process demand. Besides, our method still has the advantages such as its mathematical simplicity with no need of prehprocess.
With the characteristic size reducing as well as the power densities exponentially increasing, elevated chip temperatures are true limiters to the performance and reliability of integrated circuits. To address these thermal issues, it is essential to use a set of on-chip thermal sensors to monitor temperatures during operation. These temperature sampling results are then used by thermal management techniques to appropriately manage chip performance. In this paper, we propose a surface spline interpolation method to reconstruct the full thermal characterization of integrated circuits with non-uniform thermal sensor placements. We construct the thermal surface function using the mathematical tool of surface spline with the matrix calculation of the non-uniform sample data. Then, we take the coordinates of the points at grid locations into the surface function to get its temperature value so that we can reconstruct the full thermal signals. To evaluate the effectiveness of our method, we develop an experiment for reconstructing full thermal status of a 16-core processor. Experimental results show that our method outperforms the inverse distance weighting method based on dynamic Voronoi diagram and spectral analysis techniques both in the average absolute error metric and the hot spot absolute error metric with short enough runtime to meet the real-time process demand. Besides, our method still has the advantages such as its mathematical simplicity with no need of pre-process.
Author 王若琳 李鑫 刘文江 刘涛 戎蒙恬 周亮
AuthorAffiliation Key Laboratory of Ministry of Education of Design and Electromagnetic Compatibility" of High" Speed Electronic Systems, Shanghai Jiaotong University, Shanghai 200240, China
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CitedBy_id crossref_primary_10_1515_phys_2022_0196
crossref_primary_10_1109_TCAD_2015_2474382
crossref_primary_10_1515_phys_2022_0249
crossref_primary_10_1109_TVLSI_2020_3012833
Cites_doi 10.1016/S0098-3004(01)00005-X
10.1145/116873.116880
10.1145/1400112.1400114
10.2514/3.44330
10.1145/800186.810616
10.1587/transele.E94.C.1295
10.1109/TCAD.2008.915538
10.1145/1629911.1630038
10.1145/1837274.1837291
10.1145/1629911.1630037
10.1145/1629911.1630036
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Issue 1
Keywords dynamic thermal management
non-uniform
surface spline
thermal sensors
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dynamic thermal management, surface spline, thermal sensors, non-uniform
With the characteristic size reducing as well as the power densities exponentially increasing, elevated chip temperatures are true limiters to the performance and reliability of integrated circuits. To address these thermal issues, it is essential to use a set of on-chip thermal sensors to monitor temperatures during operation. These temperature sampling results are then used by thermal management techniques to appropriately manage chip performance. In this paper, we propose a surface spline interpolation method to reconstruct the full thermal characterization of integrated circuits with non-uniform thermal sensor placements. We construct the thermal surface function using the mathematical tool of surface spline with the matrix calculation of the non-uniform sample data. Then, we take the coordinates of the points at grid locations into the surface function to get its temperature value so that we can reconstruct the full thermal signals. To evaluate the effectiveness of our method, we develop an experiment for reconstructing full thermal status of a 16-core processor. Experimental results show that our method outperforms the inverse distance weighting method based on dynamic Voronoi diagram and spectral analysis techniques both in the average absolute error metric and the hot spot absolute error metric with short enough runtime to meet the real-time process demand. Besides, our method still has the advantages such as its mathematical simplicity with no need of prehprocess.
WANG Ruo-lin , LI Xin , LIU Wen-jiang LIU Tao, RONG Meng-tian , ZHOU Liang ey Laboratory of Ministry of Education of Design and Electromagnetic Compatibility of High Speed Electronic Systems, Shanghai Jiaotong University, Shanghai 200240, China
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References Long, Memik, Memik (CR6) 2008; 5
Harder, Desmarais (CR8) 1972; 9
Li, Rong, Liu (CR5) 2011; E94-C
Shepard (CR7) 1968
Franz (CR11) 1991; 23
Franke (CR10) 1982; 38
Nowroz, Cochran, Reda (CR13) 2010
Coskun, Rosing, Gross (CR2) 2008
Jayaseelan, Mitra (CR1) 2009
Zhang, Ankur (CR12) 2009
Memik, Mukherjee, Ni (CR3) 2008; 27
Cochran, Reda (CR4) 2009
Yu (CR9) 2001; 27
R Franke (1469_CR10) 1982; 38
A Franz (1469_CR11) 1991; 23
R L Harder (1469_CR8) 1972; 9
R Jayaseelan (1469_CR1) 2009
D Shepard (1469_CR7) 1968
A K Coskun (1469_CR2) 2008
Y Zhang (1469_CR12) 2009
S O Memik (1469_CR3) 2008; 27
Z W Yu (1469_CR9) 2001; 27
R Cochran (1469_CR4) 2009
J Long (1469_CR6) 2008; 5
A N Nowroz (1469_CR13) 2010
X Li (1469_CR5) 2011; E94-C
References_xml – volume: 27
  start-page: 877
  issue: 7
  year: 2001
  end-page: 882
  ident: CR9
  article-title: Surface interpolation from irregularly distributed points using surface splines, with Fortran program [J]
  publication-title: Computers & Geosciences
  doi: 10.1016/S0098-3004(01)00005-X
– start-page: 484
  year: 2009
  end-page: 489
  ident: CR1
  article-title: Dynamic thermal management via architectural adaptation [C]
  publication-title: Proceedings of the 46th Annual Design Automation Conference
– volume: 23
  start-page: 345
  issue: 3
  year: 1991
  end-page: 405
  ident: CR11
  article-title: Voronoi diagrams: A survey of a fundamental geometric data structure [J]
  publication-title: ACM Computing Surveys
  doi: 10.1145/116873.116880
– start-page: 213
  year: 2008
  end-page: 218
  ident: CR2
  article-title: Proactive temperature management in MPSoCs [C]
  publication-title: International Symposium on Low Power Electronics and Design
– volume: 5
  start-page: 2008
  issue: 2
  year: 2008
  end-page: 2009
  ident: CR6
  article-title: Thermal monitoring mechanisms for chip multiprocessors [J]
  publication-title: ACM Transactions on Architecture and Code Optimization
  doi: 10.1145/1400112.1400114
– volume: 9
  start-page: 189
  issue: 2
  year: 1972
  end-page: 191
  ident: CR8
  article-title: Interpolation using surface splines [J]
  publication-title: Journal of Aircraft
  doi: 10.2514/3.44330
– start-page: 478
  year: 2009
  end-page: 483
  ident: CR4
  article-title: Spectral techniques for highresolution thermal characterization with limited sensor data [C]
  publication-title: Proceedings of the 46th Annual Design Automation Conference
– start-page: 56
  year: 2010
  end-page: 61
  ident: CR13
  article-title: Thermal monitoring of real processors: Techniques for sensor allocation and full characterization [C]
  publication-title: Proceedings of the 47th Design Automation Conference
– volume: 38
  start-page: 181
  issue: 157
  year: 1982
  end-page: 200
  ident: CR10
  article-title: Scattered data interpolation: Tests of some methods [J]
  publication-title: Mathematics of Computation
– start-page: 517
  year: 1968
  end-page: 524
  ident: CR7
  article-title: A two-dimensional function for irregularly-spaced data [C]
  publication-title: Proceedings of the 1968 23rd ACM National Conference
  doi: 10.1145/800186.810616
– volume: E94-C
  start-page: 1295
  issue: 8
  year: 2011
  end-page: 1301
  ident: CR5
  article-title: Inverse distance weighting method based on a dynamic Voronoi diagram for thermal reconstruction with limited sensor data on multiprocessors [J]
  publication-title: IEICE Transactions on Electronics
  doi: 10.1587/transele.E94.C.1295
– volume: 27
  start-page: 516
  issue: 3
  year: 2008
  end-page: 527
  ident: CR3
  article-title: Optimizing thermal sensor allocation for microprocessors [J]
  publication-title: IEEE Transactions on Computer-Aided Design of Integrated Circuits
  doi: 10.1109/TCAD.2008.915538
– start-page: 472
  year: 2009
  end-page: 477
  ident: CR12
  article-title: Accurate temperature estimation using noisy thermal sensors [C]
  publication-title: Proceedings of the 46th Annual Design Automation Conference
– volume: 5
  start-page: 2008
  issue: 2
  year: 2008
  ident: 1469_CR6
  publication-title: ACM Transactions on Architecture and Code Optimization
  doi: 10.1145/1400112.1400114
– start-page: 484
  volume-title: Proceedings of the 46th Annual Design Automation Conference
  year: 2009
  ident: 1469_CR1
  doi: 10.1145/1629911.1630038
– volume: 27
  start-page: 516
  issue: 3
  year: 2008
  ident: 1469_CR3
  publication-title: IEEE Transactions on Computer-Aided Design of Integrated Circuits
  doi: 10.1109/TCAD.2008.915538
– volume: E94-C
  start-page: 1295
  issue: 8
  year: 2011
  ident: 1469_CR5
  publication-title: IEICE Transactions on Electronics
  doi: 10.1587/transele.E94.C.1295
– start-page: 56
  volume-title: Proceedings of the 47th Design Automation Conference
  year: 2010
  ident: 1469_CR13
  doi: 10.1145/1837274.1837291
– start-page: 478
  volume-title: Proceedings of the 46th Annual Design Automation Conference
  year: 2009
  ident: 1469_CR4
  doi: 10.1145/1629911.1630037
– volume: 9
  start-page: 189
  issue: 2
  year: 1972
  ident: 1469_CR8
  publication-title: Journal of Aircraft
  doi: 10.2514/3.44330
– start-page: 213
  volume-title: International Symposium on Low Power Electronics and Design
  year: 2008
  ident: 1469_CR2
– start-page: 517
  volume-title: Proceedings of the 1968 23rd ACM National Conference
  year: 1968
  ident: 1469_CR7
  doi: 10.1145/800186.810616
– volume: 38
  start-page: 181
  issue: 157
  year: 1982
  ident: 1469_CR10
  publication-title: Mathematics of Computation
– volume: 27
  start-page: 877
  issue: 7
  year: 2001
  ident: 1469_CR9
  publication-title: Computers & Geosciences
  doi: 10.1016/S0098-3004(01)00005-X
– start-page: 472
  volume-title: Proceedings of the 46th Annual Design Automation Conference
  year: 2009
  ident: 1469_CR12
  doi: 10.1145/1629911.1630036
– volume: 23
  start-page: 345
  issue: 3
  year: 1991
  ident: 1469_CR11
  publication-title: ACM Computing Surveys
  doi: 10.1145/116873.116880
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Snippet With the characteristic size reducing as well as the power densities exponentially increasing, elevated chip temperatures are true limiters to the performance...
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SubjectTerms Architecture
Chips
Computer Science
Electrical Engineering
Engineering
Error analysis
Functions (mathematics)
Integrated circuits
Life Sciences
Materials Science
Mathematical analysis
Placement
Sensors
Splines
Title Surface Spline Interpolation Method for Thermal Reconstruction with Limited Sensor Data of Non-Uniform Placements
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