APA (7th ed.) Citation

Huang, C. (2017). Applying Monte Carlo Simulation to Analyze the Open Scenario in the Assembly of Electronic Components. IEEE transactions on components, packaging, and manufacturing technology (2011), 7(11), 1911-1919. https://doi.org/10.1109/TCPMT.2017.2741520

Chicago Style (17th ed.) Citation

Huang, Chien-Yi. "Applying Monte Carlo Simulation to Analyze the Open Scenario in the Assembly of Electronic Components." IEEE Transactions on Components, Packaging, and Manufacturing Technology (2011) 7, no. 11 (2017): 1911-1919. https://doi.org/10.1109/TCPMT.2017.2741520.

MLA (9th ed.) Citation

Huang, Chien-Yi. "Applying Monte Carlo Simulation to Analyze the Open Scenario in the Assembly of Electronic Components." IEEE Transactions on Components, Packaging, and Manufacturing Technology (2011), vol. 7, no. 11, 2017, pp. 1911-1919, https://doi.org/10.1109/TCPMT.2017.2741520.