Thermal Analysis of Solder Joint Based on Eddy Current Pulsed Thermography

• Published in: IEEE transactions on components, packaging, and manufacturing technology (2011) Vol. 7; no. 7; pp. 1111 - 1118
• Main Authors: Zhou, Xiuyun, Xue, Yun, Tian, Guiyun, Liu, Zhen
• Format: Journal Article
• Language: English
• Published: Piscataway IEEE 01.07.2017; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Bonding; Breaking down; Computer simulation; Defects; Eddy current pulsed thermography (ECPT); Eddy currents; Heat transfer; Heating systems; Mathematical models; Overheating; Pins; pseudo soldering; Reliability analysis; Soldering; Surface-mounted devices; Temperature distribution; Temperature gradients; Thermal analysis; Thermal design; Thermal energy; Thermal resistance; Thermography; Three dimensional models

Solder joint provides electronic and mechanical connections between components and substrate. Overheating and excessive temperature gradient can cause solder joint failures and then make the whole system breakdown. Thus, thermal analysis has been the hotspot in reliability evaluation of electronic p...