Thermal Analysis of Solder Joint Based on Eddy Current Pulsed Thermography - Zhou, Xiuyun; Xue, Yun; Tian, Guiyun; Liu, Zhen (IEEE transactions on components, packaging, and manufacturing technology (2011), 2017)
Keywords: Bonding; Breaking down; Computer simulation; Defects; Eddy current pulsed thermography (ECPT); Eddy currents; Heat transfer; Heating systems; Mathematical models; Overheating; Pins; pseudo soldering; Reliability analysis; Soldering; Surface-mounted devices; Temperature distribution; Temperature gradients; Thermal analysis; Thermal design; Thermal energy; Thermal resistance; Thermography; Three dimensional models