APA (7th ed.) Citation

Zhou, X., Xue, Y., Tian, G., & Liu, Z. (2017). Thermal Analysis of Solder Joint Based on Eddy Current Pulsed Thermography. IEEE transactions on components, packaging, and manufacturing technology (2011), 7(7), 1111-1118. https://doi.org/10.1109/TCPMT.2017.2696159

Chicago Style (17th ed.) Citation

Zhou, Xiuyun, Yun Xue, Guiyun Tian, and Zhen Liu. "Thermal Analysis of Solder Joint Based on Eddy Current Pulsed Thermography." IEEE Transactions on Components, Packaging, and Manufacturing Technology (2011) 7, no. 7 (2017): 1111-1118. https://doi.org/10.1109/TCPMT.2017.2696159.

MLA (9th ed.) Citation

Zhou, Xiuyun, et al. "Thermal Analysis of Solder Joint Based on Eddy Current Pulsed Thermography." IEEE Transactions on Components, Packaging, and Manufacturing Technology (2011), vol. 7, no. 7, 2017, pp. 1111-1118, https://doi.org/10.1109/TCPMT.2017.2696159.