An Ultra-Thin, High-Power, and Multilayer Organic Antenna Array With T/R Functionality in the X-Band
The transmit-receive (T/R) operation of an ultra-thin organic antenna array is presented at a center frequency of 9.5 GHz. High transmit power is achieved while maintaining an ultra-low profile in a novel system-on-a-package scheme whereby 32 silicon-germanium (SiGe), transmit/receive integrated-cir...
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Published in | IEEE transactions on microwave theory and techniques Vol. 60; no. 12; pp. 3856 - 3867 |
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Main Authors | , , , , , , |
Format | Journal Article |
Language | English |
Published |
New York, NY
IEEE
01.12.2012
Institute of Electrical and Electronics Engineers |
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Abstract | The transmit-receive (T/R) operation of an ultra-thin organic antenna array is presented at a center frequency of 9.5 GHz. High transmit power is achieved while maintaining an ultra-low profile in a novel system-on-a-package scheme whereby 32 silicon-germanium (SiGe), transmit/receive integrated-circuit (TRIC) modules have been flip-chip bonded to the array board. Each SiGe TRIC drives a pair of slot-coupled microstrip patch antennas that form an 8 × 8 rectangular array, which is all packaged in an organic substrate stack of liquid crystal polymer and RT/Duroid 5880LZ. The organic package occupies an area of 30.5 cm × 25.4 cm and has a total thickness of only 1.80 mm. The small-signal characterization of the array showed a G / T =-6.64 dB , and a measured receive gain of 20.1 dB with a variation of 0.7 dB over a 1-GHz bandwidth (BW). Finally, far-field large-signal experiments showed a measured effective isotropically radiated power of 47.1 dBm with a variation of 2.36 dB over the same BW, and without the aid of additional thermal management components. |
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AbstractList | The transmit-receive (T/R) operation of an ultra-thin organic antenna array is presented at a center frequency of 9.5 GHz. High transmit power is achieved while maintaining an ultra-low profile in a novel system-on-a-package scheme whereby 32 silicon-germanium (SiGe), transmit/receive integrated-circuit (TRIC) modules have been flip-chip bonded to the array board. Each SiGe TRIC drives a pair of slot-coupled microstrip patch antennas that form an 8 × 8 rectangular array, which is all packaged in an organic substrate stack of liquid crystal polymer and RT/Duroid 5880LZ. The organic package occupies an area of 30.5 cm × 25.4 cm and has a total thickness of only 1.80 mm. The small-signal characterization of the array showed a G / T =-6.64 dB , and a measured receive gain of 20.1 dB with a variation of 0.7 dB over a 1-GHz bandwidth (BW). Finally, far-field large-signal experiments showed a measured effective isotropically radiated power of 47.1 dBm with a variation of 2.36 dB over the same BW, and without the aid of additional thermal management components. |
Author | Patterson, C. E. Poh, C. H. J. Papapolymerou, J. Coen, C. Donado Morcillo, Carlos A. Cressler, J. D. Lacroix, B. |
Author_xml | – sequence: 1 givenname: Carlos A. surname: Donado Morcillo fullname: Donado Morcillo, Carlos A. email: cdonado@gatech.edu organization: Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA – sequence: 2 givenname: C. E. surname: Patterson fullname: Patterson, C. E. organization: Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA – sequence: 3 givenname: B. surname: Lacroix fullname: Lacroix, B. organization: Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA – sequence: 4 givenname: C. surname: Coen fullname: Coen, C. organization: Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA – sequence: 5 givenname: C. H. J. surname: Poh fullname: Poh, C. H. J. organization: Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA – sequence: 6 givenname: J. D. surname: Cressler fullname: Cressler, J. D. organization: Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA – sequence: 7 givenname: J. surname: Papapolymerou fullname: Papapolymerou, J. organization: Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA |
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Keywords | Thermal management (packaging) Stacking Small signal behavior Ge-Si alloys radar antennas Field experiment Electronic packaging Microstrip antenna Microstrip antennas Organic material Antenna array Ultrathin films X band Thermal behavior Flip-chip Large signal behavior Printed antenna Multiple layer Far field Centimetric wave silicon germanium Planar antenna arrays High power Liquid crystal polymers Integrated circuit organic materials planar arrays Radiated power System on package Gain |
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SubjectTerms | Antenna arrays Antennas Applied sciences Arrays Circuit properties Design. Technologies. Operation analysis. Testing Electric, optical and optoelectronic circuits Electronics Exact sciences and technology Integrated circuits Microstrip Microstrip antenna Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits organic materials planar arrays radar antennas Radio frequency Radiocommunications Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Silicon germanium Stripline Substrates Telecommunications Telecommunications and information theory |
Title | An Ultra-Thin, High-Power, and Multilayer Organic Antenna Array With T/R Functionality in the X-Band |
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