Wearable Flexible Temperature Sensor Suite for Thermal-Tactile Perception

Qualitative and quantitative analysis of object temperature plays a vital role in wearable technologies and tactile-perception-based applications. It has been the subject of numerous studies for developing soft, bio-compatible, and flexible temperature sensors. When these sensors are encapsulated an...

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Published inIEEE sensors journal Vol. 24; no. 23; pp. 39736 - 39743
Main Authors Krishnan, Athul, Thiyagarajan, Karthick, Kodagoda, Sarath, Bhattacharjee, Mitradip
Format Journal Article
LanguageEnglish
Published New York IEEE 01.12.2024
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
4-ethylenedioxythiophene):poly(styr-enesulfonate) (PEDOT:PSS
Biocompatibility
Biomedical monitoring
Electronic modules
Encapsulation
Flexible temperature sensor
Graphene
graphene oxide (GO) + poly
Monitoring
Nitrile rubber
Perception
Qualitative analysis
Recovery time
Resistance
Robot sensing systems
sensor encapsulation
Sensor phenomena and characterization
Sensors
Tactile discrimination
Temperature measurement
Temperature sensors
thermal-tactile perception
wearable sensor
Wearable sensors
Wearable technology
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Abstract Qualitative and quantitative analysis of object temperature plays a vital role in wearable technologies and tactile-perception-based applications. It has been the subject of numerous studies for developing soft, bio-compatible, and flexible temperature sensors. When these sensors are encapsulated and integrated with electronic modules for various wearable healthcare monitoring and thermal perception applications, they tend to deviate from their original performances. In this article, we report the design and development of an encapsulated flexible temperature sensor wearable suite based on graphene oxide (GO) + poly(3,4-ethylenedioxythiophene):poly(styr-enesulfonate) (PEDOT:PSS) composite and commercially available nitrile butadiene rubber sheet encapsulation for investigating the encapsulation impacts. The design of the bio-compatible sensor caters to wearable health monitoring systems and thermal perception applications. Due to the implications of sensor encapsulation, experimental results show a 19.15% sensitivity value degradation, a reaction time difference of 0.84 s, and a recovery time difference of 16.5 s when compared with the unencapsulated sensor structure. Furthermore, the encapsulated sensor structure is integrated into a thermal, tactile-perception-based wireless monitoring framework.
AbstractList Qualitative and quantitative analysis of object temperature plays a vital role in wearable technologies and tactile-perception-based applications. It has been the subject of numerous studies for developing soft, bio-compatible, and flexible temperature sensors. When these sensors are encapsulated and integrated with electronic modules for various wearable healthcare monitoring and thermal perception applications, they tend to deviate from their original performances. In this article, we report the design and development of an encapsulated flexible temperature sensor wearable suite based on graphene oxide (GO) + poly(3,4-ethylenedioxythiophene):poly(styr-enesulfonate) (PEDOT:PSS) composite and commercially available nitrile butadiene rubber sheet encapsulation for investigating the encapsulation impacts. The design of the bio-compatible sensor caters to wearable health monitoring systems and thermal perception applications. Due to the implications of sensor encapsulation, experimental results show a 19.15% sensitivity value degradation, a reaction time difference of 0.84 s, and a recovery time difference of 16.5 s when compared with the unencapsulated sensor structure. Furthermore, the encapsulated sensor structure is integrated into a thermal, tactile-perception-based wireless monitoring framework.
Author Krishnan, Athul
Kodagoda, Sarath
Bhattacharjee, Mitradip
Thiyagarajan, Karthick
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10.1007/s13197-019-04172-z
10.1109/JSEN.2015.2505782
10.1016/j.mne.2023.100218
10.1038/s41528-023-00261-4
10.1016/j.bios.2022.114999
10.1109/fleps53764.2022.9781483
10.1002/smll.202206839
10.1002/advs.202201525
10.1016/j.tsf.2019.01.034
10.1109/JSEN.2024.3407790
10.1063/5.0187539
10.1021/acsanm.3c02403
10.1109/JFLEX.2023.3243877
10.1097/00000542-200003000-00014
10.1016/j.coco.2020.03.011
10.1016/j.sna.2019.05.006
10.1109/JSEN.2022.3186148
10.1111/j.1600-0536.1988.tb02953.x
10.1016/j.sna.2023.114224
10.3168/jds.2016-11771
10.1088/1741-2552/abd683
10.3390/molecules28104083
10.1016/j.nanoen.2024.109291
10.1088/2058-8585/acd06e
10.1007/s10854-022-07875-w
10.1016/j.nanoen.2023.108788
10.1038/srep35289
10.1021/nn404889b
10.1109/HAPTIC.2002.998951
10.1007/s10854-024-12545-0
10.1002/stc.1674
10.3390/s100907934
10.1002/advs.202307693
10.1016/j.mtphys.2022.100951
10.1016/j.cej.2023.142518
10.1081/FRI-200033462
10.1002/polb.23192
10.1016/j.mseb.2015.11.003
10.3390/s18051400
10.3390/s18092996
10.1016/j.isatra.2022.07.020
10.1016/j.jece.2024.113872
10.1021/acsami.3c08319
10.1038/s41378-024-00723-3
10.1016/j.cej.2024.153271
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References ref13
ref35
ref12
ref34
ref15
ref37
ref14
ref36
ref31
ref30
ref11
ref33
ref10
ref2
ref1
ref17
ref39
ref16
ref38
ref19
ref18
ref24
ref46
ref23
ref45
ref26
ref25
ref47
ref20
ref42
ref41
ref22
ref44
ref21
ref43
ref28
ref27
ref29
ref8
ref7
ref9
ref4
ref3
ref6
ref5
Hosseini (ref32) 2019
ref40
References_xml – ident: ref31
  doi: 10.3390/s24061944
– ident: ref38
  doi: 10.1007/s13197-019-04172-z
– ident: ref44
  doi: 10.1109/JSEN.2015.2505782
– ident: ref15
  doi: 10.1016/j.mne.2023.100218
– ident: ref6
  doi: 10.1038/s41528-023-00261-4
– ident: ref19
  doi: 10.1016/j.bios.2022.114999
– ident: ref35
  doi: 10.1109/fleps53764.2022.9781483
– ident: ref16
  doi: 10.1002/smll.202206839
– ident: ref4
  doi: 10.1002/advs.202201525
– ident: ref36
  doi: 10.1016/j.tsf.2019.01.034
– ident: ref11
  doi: 10.1109/JSEN.2024.3407790
– ident: ref27
  doi: 10.1063/5.0187539
– ident: ref18
  doi: 10.1021/acsanm.3c02403
– ident: ref5
  doi: 10.1109/JFLEX.2023.3243877
– ident: ref1
  doi: 10.1097/00000542-200003000-00014
– ident: ref41
  doi: 10.1016/j.coco.2020.03.011
– ident: ref37
  doi: 10.1016/j.sna.2019.05.006
– volume-title: From A to Z: Wearables in Modern Medicine
  year: 2019
  ident: ref32
  article-title: Wearable technologies for monitoring and treatment of chronic wounds
– ident: ref26
  doi: 10.1109/JSEN.2022.3186148
– ident: ref47
  doi: 10.1111/j.1600-0536.1988.tb02953.x
– ident: ref12
  doi: 10.1016/j.sna.2023.114224
– ident: ref3
  doi: 10.3168/jds.2016-11771
– ident: ref39
  doi: 10.1088/1741-2552/abd683
– ident: ref25
  doi: 10.3390/molecules28104083
– ident: ref17
  doi: 10.1016/j.nanoen.2024.109291
– ident: ref13
  doi: 10.1088/2058-8585/acd06e
– ident: ref8
  doi: 10.1007/s10854-022-07875-w
– ident: ref28
  doi: 10.1016/j.nanoen.2023.108788
– ident: ref43
  doi: 10.1038/srep35289
– ident: ref45
  doi: 10.1021/nn404889b
– ident: ref2
  doi: 10.1109/HAPTIC.2002.998951
– ident: ref30
  doi: 10.1007/s10854-024-12545-0
– ident: ref42
  doi: 10.1002/stc.1674
– ident: ref14
  doi: 10.3390/s100907934
– ident: ref9
  doi: 10.1002/advs.202307693
– ident: ref29
  doi: 10.1016/j.mtphys.2022.100951
– ident: ref24
  doi: 10.1016/j.cej.2023.142518
– ident: ref40
  doi: 10.1081/FRI-200033462
– ident: ref46
  doi: 10.1002/polb.23192
– ident: ref23
  doi: 10.1016/j.mseb.2015.11.003
– ident: ref20
  doi: 10.3390/s18051400
– ident: ref21
  doi: 10.3390/s18092996
– ident: ref7
  doi: 10.1016/j.isatra.2022.07.020
– ident: ref22
  doi: 10.1016/j.jece.2024.113872
– ident: ref33
  doi: 10.1021/acsami.3c08319
– ident: ref10
  doi: 10.1038/s41378-024-00723-3
– ident: ref34
  doi: 10.1016/j.cej.2024.153271
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SubjectTerms 4-ethylenedioxythiophene):poly(styr-enesulfonate) (PEDOT:PSS
Biocompatibility
Biomedical monitoring
Electronic modules
Encapsulation
Flexible temperature sensor
Graphene
graphene oxide (GO) + poly
Monitoring
Nitrile rubber
Perception
Qualitative analysis
Recovery time
Resistance
Robot sensing systems
sensor encapsulation
Sensor phenomena and characterization
Sensors
Tactile discrimination
Temperature measurement
Temperature sensors
thermal-tactile perception
wearable sensor
Wearable sensors
Wearable technology
Title Wearable Flexible Temperature Sensor Suite for Thermal-Tactile Perception
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