Effect of Organic Compounds on Electrodeposition of Iridium
Superior hardness, heat resistance and chemical resistance make iridium electroplates attractive for functional materials e.g. of electrochromic elements. In experiments with sodium iridium (III) hexabromate baths, oxalic acid displayed a stabilizing effect and extended the coating life by a factor...
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| Published in | Hyōmen gijutsu Vol. 44; no. 12; pp. 1173 - 1174 |
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| Main Authors | , |
| Format | Journal Article |
| Language | English Japanese |
| Published |
Tokyo
The Surface Finishing Society of Japan
01.01.1993
Japan Science and Technology Agency |
| Subjects | |
| Online Access | Get full text |
| ISSN | 0915-1869 1884-3409 |
| DOI | 10.4139/sfj.44.1173 |
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| Abstract | Superior hardness, heat resistance and chemical resistance make iridium electroplates attractive for functional materials e.g. of electrochromic elements. In experiments with sodium iridium (III) hexabromate baths, oxalic acid displayed a stabilizing effect and extended the coating life by a factor of 10. Electroplate cracking was greatly reduced as well. Additions of EDTA4Na were found to retard iridium deposition. The baseline plating bath contained 0.052 mol/dm exp 3 the sodium-iridium complex salt, 0.65 mol/dm exp 3 oxalic acid. Its pH was adjusted to 5 by adding an approximately 2.5N aqueous solution of sodium hydroxide. The organic compounds were added in an amount of 0.02 mol/dm exp 3 . The current density was 1.5 mA/cm exp 2 , the bath temperature 85 deg C. The substrate was brass with a gold plate 1 mu m thick. |
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| AbstractList | Superior hardness, heat resistance and chemical resistance make iridium electroplates attractive for functional materials e.g. of electrochromic elements. In experiments with sodium iridium (III) hexabromate baths, oxalic acid displayed a stabilizing effect and extended the coating life by a factor of 10. Electroplate cracking was greatly reduced as well. Additions of EDTA4Na were found to retard iridium deposition. The baseline plating bath contained 0.052 mol/dm exp 3 the sodium-iridium complex salt, 0.65 mol/dm exp 3 oxalic acid. Its pH was adjusted to 5 by adding an approximately 2.5N aqueous solution of sodium hydroxide. The organic compounds were added in an amount of 0.02 mol/dm exp 3 . The current density was 1.5 mA/cm exp 2 , the bath temperature 85 deg C. The substrate was brass with a gold plate 1 mu m thick. |
| Author | SAITO, Yumiko KITADA, Katsutsugu |
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| References | 1) T. Yoshino, N. Baba, K. Arai; Jpn. J. Appl. Phys., 26, 1547 (1987 2) C. J. Tyrrell; Trans. Inst. Metalfinish., 43, 161 (1965 5) 尾崎萃, 中原勝儼, 安盛岩雄, 石森達二郎, 飯田逸夫; 貴金属の化学と応用, p. 348 (講談社, 1984 3) G. A. Conn; Plating, 52, 1258 (1965 4) 久保田昇, 吉村俊一, 佐藤栄一; 表面技術, 40, 132 (1989 |
| References_xml | – reference: 2) C. J. Tyrrell; Trans. Inst. Metalfinish., 43, 161 (1965) – reference: 5) 尾崎萃, 中原勝儼, 安盛岩雄, 石森達二郎, 飯田逸夫; 貴金属の化学と応用, p. 348 (講談社, 1984) – reference: 1) T. Yoshino, N. Baba, K. Arai; Jpn. J. Appl. Phys., 26, 1547 (1987) – reference: 4) 久保田昇, 吉村俊一, 佐藤栄一; 表面技術, 40, 132 (1989) – reference: 3) G. A. Conn; Plating, 52, 1258 (1965) |
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| Title | Effect of Organic Compounds on Electrodeposition of Iridium |
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