3D Printed E-Band Hybrid Coupler
In this letter, an additively manufactured 3,dB hybrid coupler is presented. While the geometrical structure is generated by a stereolithography (SLA) printer from UV curable photopolymer resin as one single part, conductive coating is provided by an electroless silverplating process. The utilized s...
Saved in:
Published in | IEEE microwave and wireless components letters Vol. 29; no. 9; pp. 1 - 3 |
---|---|
Main Authors | , , , , , , |
Format | Journal Article |
Language | English |
Published |
IEEE
01.09.2019
|
Subjects | |
Online Access | Get full text |
ISSN | 1531-1309 1558-1764 |
DOI | 10.1109/LMWC.2019.2931458 |
Cover
Loading…
Abstract | In this letter, an additively manufactured 3,dB hybrid coupler is presented. While the geometrical structure is generated by a stereolithography (SLA) printer from UV curable photopolymer resin as one single part, conductive coating is provided by an electroless silverplating process. The utilized slotted waveguide approach improves the solvent flow during metal plating and therefore enables the fabrication of complex waveguide structures. Measured imbalance between the through and coupling ports stays below 1.5,dB over the entire E-band, while the respective phase difference ranges only between 87° and 91° despite the challenges of additive manufacturing in such frequency regions. |
---|---|
AbstractList | In this letter, an additively manufactured 3,dB hybrid coupler is presented. While the geometrical structure is generated by a stereolithography (SLA) printer from UV curable photopolymer resin as one single part, conductive coating is provided by an electroless silverplating process. The utilized slotted waveguide approach improves the solvent flow during metal plating and therefore enables the fabrication of complex waveguide structures. Measured imbalance between the through and coupling ports stays below 1.5,dB over the entire E-band, while the respective phase difference ranges only between 87° and 91° despite the challenges of additive manufacturing in such frequency regions. |
Author | Gold, G. Ringel, J. Ringel, L. Helmreich, K. Lomakin, K. Sippel, M. Klein, L. |
Author_xml | – sequence: 1 givenname: K. orcidid: 0000-0003-0947-5267 surname: Lomakin fullname: Lomakin, K. organization: Institute of Microwaves and Photonics, Friedrich-Alexander University Erlangen-Nuernberg (FAU), 91058 Erlangen, Germany (e-mail: konstantin.lomakin@fau.de) – sequence: 2 givenname: L. surname: Klein fullname: Klein, L. organization: Institute of Microwaves and Photonics, Friedrich-Alexander University Erlangen-Nuernberg (FAU), 91058 Erlangen, Germany – sequence: 3 givenname: L. surname: Ringel fullname: Ringel, L. organization: Institute of Microwaves and Photonics, Friedrich-Alexander University Erlangen-Nuernberg (FAU), 91058 Erlangen, Germany – sequence: 4 givenname: J. orcidid: 0000-0002-0046-3414 surname: Ringel fullname: Ringel, J. organization: Institute of Microwaves and Photonics, Friedrich-Alexander University Erlangen-Nuernberg (FAU), 91058 Erlangen, Germany – sequence: 5 givenname: M. orcidid: 0000-0002-9585-0547 surname: Sippel fullname: Sippel, M. organization: Institute of Microwaves and Photonics, Friedrich-Alexander University Erlangen-Nuernberg (FAU), 91058 Erlangen, Germany – sequence: 6 givenname: K. surname: Helmreich fullname: Helmreich, K. organization: Institute of Microwaves and Photonics, Friedrich-Alexander University Erlangen-Nuernberg (FAU), 91058 Erlangen, Germany – sequence: 7 givenname: G. orcidid: 0000-0002-3862-368X surname: Gold fullname: Gold, G. organization: Institute of Microwaves and Photonics, Friedrich-Alexander University Erlangen-Nuernberg (FAU), 91058 Erlangen, Germany |
BookMark | eNp9j7FOwzAURS1UJNrCByCW_IDDe7aT2COEliIFwQBitOzEloxCUjlh6N-TqBUDA9N9wz3v6qzIous7R8g1QooI6rZ6_ihTBqhSpjiKTJ6RJWaZpFjkYjHfHClyUBdkNQyfACikwCVJ-EPyGkM3uibZ0HvTNcnuYGNokrL_3rcuXpJzb9rBXZ1yTd63m7dyR6uXx6fyrqL1NDhSa7BWzFluBAhnPYrc8sZYadFbyQwamU3rEmqZC45eIDDuBRQKsMkl8DUpjn_r2A9DdF7XYTRj6LsxmtBqBD2L6llUz6L6JDqR-Ifcx_Bl4uFf5ubIBOfcb19KUAyA_wBeMF2e |
CODEN | IMWCBJ |
CitedBy_id | crossref_primary_10_1002_mop_32623 crossref_primary_10_1109_OJAP_2023_3283994 crossref_primary_10_1109_ACCESS_2022_3162830 crossref_primary_10_1109_TCPMT_2023_3306772 crossref_primary_10_1016_j_aeue_2020_153569 crossref_primary_10_3390_app12010212 crossref_primary_10_1109_TMTT_2023_3239363 crossref_primary_10_1109_ACCESS_2024_3408671 crossref_primary_10_1109_LMWC_2021_3070745 crossref_primary_10_1109_JSAC_2024_3389125 crossref_primary_10_1109_LMWC_2022_3182868 crossref_primary_10_1002_pat_6369 crossref_primary_10_1017_S1759078721000647 crossref_primary_10_1109_TCPMT_2024_3469638 crossref_primary_10_1016_j_jestch_2022_101129 crossref_primary_10_1016_j_matdes_2023_112044 |
Cites_doi | 10.1007/978-1-4419-1120-9 10.1109/TMTT.2018.2889452 10.1109/TMTT.1959.1124587 10.1109/LAWP.2018.2857807 10.1109/JRPROC.1952.274021 10.1109/MWSYM.2019.8700864 10.1109/TELSKS.2007.4375921 10.1109/APMC.2016.7931434 10.1109/TCPMT.2019.2927671 10.1049/el:20073127 10.1002/mmce.20599 10.1109/LMWC.2005.863199 10.1109/TMTT.2016.2574839 |
ContentType | Journal Article |
DBID | 97E RIA RIE AAYXX CITATION |
DOI | 10.1109/LMWC.2019.2931458 |
DatabaseName | IEEE All-Society Periodicals Package (ASPP) 2005–Present IEEE All-Society Periodicals Package (ASPP) 1998–Present IEEE/IET Electronic Library (IEL) (UW System Shared) CrossRef |
DatabaseTitle | CrossRef |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: RIE name: IEEE/IET Electronic Library (IEL) (UW System Shared) url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/ sourceTypes: Publisher |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Engineering Physics |
EISSN | 1558-1764 |
EndPage | 3 |
ExternalDocumentID | 10_1109_LMWC_2019_2931458 8809200 |
Genre | orig-research |
GroupedDBID | -~X 0R~ 29I 4.4 5GY 5VS 6IK 97E AAJGR AARMG AASAJ AAWTH ABAZT ABQJQ ABVLG ACGFO ACIWK AENEX AGQYO AHBIQ AKJIK AKQYR ALMA_UNASSIGNED_HOLDINGS ATWAV BEFXN BFFAM BGNUA BKEBE BPEOZ CS3 DU5 EBS EJD F5P HZ~ IFIPE IPLJI JAVBF LAI M43 O9- OCL RIA RIE RNS AAYXX AETIX AFFNX AGSQL AIBXA CITATION H~9 RIG |
ID | FETCH-LOGICAL-c293t-ba1c92eb3a404ebf146b3dab8b1fb82a1a8530980c86431f41023f407901d6803 |
IEDL.DBID | RIE |
ISSN | 1531-1309 |
IngestDate | Tue Jul 01 01:00:41 EDT 2025 Thu Apr 24 22:56:55 EDT 2025 Wed Aug 27 02:46:12 EDT 2025 |
IsPeerReviewed | true |
IsScholarly | true |
Issue | 9 |
Language | English |
License | https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html https://doi.org/10.15223/policy-029 https://doi.org/10.15223/policy-037 |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-c293t-ba1c92eb3a404ebf146b3dab8b1fb82a1a8530980c86431f41023f407901d6803 |
ORCID | 0000-0002-9585-0547 0000-0002-3862-368X 0000-0002-0046-3414 0000-0003-0947-5267 0000-0003-3561-9017 |
PageCount | 3 |
ParticipantIDs | ieee_primary_8809200 crossref_primary_10_1109_LMWC_2019_2931458 crossref_citationtrail_10_1109_LMWC_2019_2931458 |
ProviderPackageCode | CITATION AAYXX |
PublicationCentury | 2000 |
PublicationDate | 2019-09-01 |
PublicationDateYYYYMMDD | 2019-09-01 |
PublicationDate_xml | – month: 09 year: 2019 text: 2019-09-01 day: 01 |
PublicationDecade | 2010 |
PublicationTitle | IEEE microwave and wireless components letters |
PublicationTitleAbbrev | LMWC |
PublicationYear | 2019 |
Publisher | IEEE |
Publisher_xml | – name: IEEE |
References | ref13 ref12 ref15 ref14 ref11 ref2 ref1 ref8 ref7 ref9 ref4 ref6 ref5 sarhan (ref3) 2013; 4 lomakin (ref10) 2018 |
References_xml | – start-page: 1409 year: 2018 ident: ref10 article-title: 3D printed slotted waveguide array antenna for automotive radar applications in W- band publication-title: Proc 48th Eur Microw Conf (EuMC) – ident: ref8 doi: 10.1007/978-1-4419-1120-9 – ident: ref12 doi: 10.1109/TMTT.2018.2889452 – ident: ref1 doi: 10.1109/TMTT.1959.1124587 – ident: ref9 doi: 10.1109/LAWP.2018.2857807 – ident: ref2 doi: 10.1109/JRPROC.1952.274021 – volume: 4 start-page: 1021 year: 2013 ident: ref3 article-title: Optimized broad band riblet short-slot waveguide coupler for X-band applications publication-title: Int J Sci Eng Res – ident: ref13 doi: 10.1109/MWSYM.2019.8700864 – ident: ref7 doi: 10.1109/TELSKS.2007.4375921 – ident: ref11 doi: 10.1109/APMC.2016.7931434 – ident: ref15 doi: 10.1109/TCPMT.2019.2927671 – ident: ref6 doi: 10.1049/el:20073127 – ident: ref5 doi: 10.1002/mmce.20599 – ident: ref4 doi: 10.1109/LMWC.2005.863199 – ident: ref14 doi: 10.1109/TMTT.2016.2574839 |
SSID | ssj0014841 |
Score | 2.4318027 |
Snippet | In this letter, an additively manufactured 3,dB hybrid coupler is presented. While the geometrical structure is generated by a stereolithography (SLA) printer... |
SourceID | crossref ieee |
SourceType | Enrichment Source Index Database Publisher |
StartPage | 1 |
SubjectTerms | Additive manufacturing Couplers Couplings electroless silverplating hybrid coupler Plating slotted waveguides Substrates Three-dimensional displays Three-dimensional printing Waveguide components |
Title | 3D Printed E-Band Hybrid Coupler |
URI | https://ieeexplore.ieee.org/document/8809200 |
Volume | 29 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV3PS8MwFH7MgaAHf2yK8xc9eBLTJUtck6POjSFOPDjcrSRpcnF0Y7YH_etN2q4MEfFWSgLpl0fe-5r3vgdwxajjWxG2iDlfgJgyDHEuMTKmF0WUUasKndnJc388ZY-z21kDbupaGGNMkXxmQv9Y3OUnC537X2VdZ2vC7eoWbDniVtZq1TcGjLNKG5Ugdy6L6gaTYNF9mrwNfBKXCJ1vI8x3d9_wQRtNVQqfMtqHyXo1ZSrJe5hnKtRfP4Qa_7vcA9irgsvgrrSGQ2iYtAW7G5KDLdguUj71RxsC-hC8rLxcRBIM0b1Mk2D86eu3gsEiX87N6gimo-HrYIyqfglIuw_LkJJEi55jx5JhZpR1h6CiiVRcEat4TxLp9gMLjjV3cQixzMs2WMfoXEyQ9Dmmx9BMF6k5gUBpKpXXhreRZRF3tCjhVPpwjCXKCtIBvEYw1pWYuO9pMY8LUoFF7EGPPehxBXoHruspy1JJ46_BbY9nPbCC8vT312ew4yeXqV_n0MxWublwsUKmLgsj-QZ7V7W4 |
linkProvider | IEEE |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV07T8MwED6VIgQMPAqI8szAhHBqN27jjFBaBWgqhlZ0i-zEXqjSqiQD_HrsJI0qhBBbZDmR8_nku_PdfQdwQx3tb7lYIap1AaJCUsQYx0jKtus61FEi55kNRl1_Qp-nnWkN7qpaGCllnnwmbfOYx_LjeZSZq7KWljVP7-oGbHZMMW5RrVXFDCijJTsqQfpk9soYJsFeaxi89Uwal2dr7Uao6e--poXW2qrkWmWwD8FqPUUyybudpcKOvn5QNf53wQewV5qX1n0hD4dQk0kDdtdIBxuwlSd9Rh9HYDmP1uvSEEbEVh898CS2_E9TwWX15tliJpfHMBn0xz0flR0TUKR_LEWCk8hra_-YU0ylUPoYFE7MBRNECdbmhOsdwR7DEdOWCFHUEDco7dNpqyDuMuycQD2ZJ_IULBE5XBh2eOUq6jLtGMXM4cYgo7FQHmkCXiEYRiWduOlqMQtztwJ7oQE9NKCHJehNuK1eWRRcGn9NPjJ4VhNLKM9-H76GbX8cDMPh0-jlHHbMh4pEsAuop8tMXmrLIRVXucB8AymSuQA |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=3D+Printed+E-Band+Hybrid+Coupler&rft.jtitle=IEEE+microwave+and+wireless+components+letters&rft.au=Lomakin%2C+K.&rft.au=Klein%2C+L.&rft.au=Ringel%2C+L.&rft.au=Ringel%2C+J.&rft.date=2019-09-01&rft.pub=IEEE&rft.issn=1531-1309&rft.spage=1&rft.epage=3&rft_id=info:doi/10.1109%2FLMWC.2019.2931458&rft.externalDocID=8809200 |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=1531-1309&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=1531-1309&client=summon |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=1531-1309&client=summon |