A 120-GHz Bandwidth CMOS Distributed Power Amplifier With Multi-Drive Intra-Stack Coupling

• Published in: IEEE microwave and wireless components letters Vol. 30; no. 8; pp. 782 - 785
• Main Authors: El-Aassar, Omar, Rebeiz, Gabriel M.
• Format: Journal Article
• Language: English
• Published: IEEE 01.08.2020
• Subjects: Bandwidth; CMOS silicon-on-insulator (SOI); Couplings; Frequency measurement; Gain; gainbandwidth product (GBW); Impedance; instrumentation; Logic gates; Mach-Zehnder Modulator (MZM) driver; millimeter-waves; optical-wireline; power amplifier (PA); Power measurement; stacked amplifier; transformer; ultrawideband (UWB)

This letter presents a distributed power amplifier (DPA) topology that improves both the power combining efficiency and the operation bandwidth. Multi-drive intra-stack coupling is introduced in the design of the gain cells to break the tradeoff between high output power (<inline-formula> <...