An Ultrahigh Sensitivity Microwave Sensor for Microfluidic Applications

This work shows an ultrahigh sensitivity microwave sensor for microfluidic applications. The proposed sensor is made of a microstrip line loaded with a complementary splitring resonator (CSRR). The meander slot is adopted in the CSRR to achieve high field confinement and is therefore covered with a...

Full description

Saved in:
Bibliographic Details
Published inIEEE microwave and wireless components letters Vol. 30; no. 12; pp. 1201 - 1204
Main Authors Fan, Li-Chao, Zhao, Wen-Sheng, Wang, Da-Wei, Liu, Qi, Chen, Shichang, Wang, Gaofeng
Format Journal Article
LanguageEnglish
Published IEEE 01.12.2020
Subjects
Online AccessGet full text

Cover

Loading…
Abstract This work shows an ultrahigh sensitivity microwave sensor for microfluidic applications. The proposed sensor is made of a microstrip line loaded with a complementary splitring resonator (CSRR). The meander slot is adopted in the CSRR to achieve high field confinement and is therefore covered with a polydimethylsiloxane (PDMS) microfluidic channel to enable strong interaction between the field and the liquid sample. The complex permittivity of the liquid sample can be retrieved by the variations in the resonant frequency and peak attenuation. The proposed design requires a very small liquid volume of ~0.5 μL while offering a high sensitivity. A prototype is fabricated and tested, with a good agreement achieved between the extracted values and the reference data.
AbstractList This work shows an ultrahigh sensitivity microwave sensor for microfluidic applications. The proposed sensor is made of a microstrip line loaded with a complementary splitring resonator (CSRR). The meander slot is adopted in the CSRR to achieve high field confinement and is therefore covered with a polydimethylsiloxane (PDMS) microfluidic channel to enable strong interaction between the field and the liquid sample. The complex permittivity of the liquid sample can be retrieved by the variations in the resonant frequency and peak attenuation. The proposed design requires a very small liquid volume of ~0.5 μL while offering a high sensitivity. A prototype is fabricated and tested, with a good agreement achieved between the extracted values and the reference data.
Author Chen, Shichang
Wang, Gaofeng
Zhao, Wen-Sheng
Wang, Da-Wei
Fan, Li-Chao
Liu, Qi
Author_xml – sequence: 1
  givenname: Li-Chao
  surname: Fan
  fullname: Fan, Li-Chao
  organization: MOE Engineering Research Center of Smart Microsensors and Microsystems, School of Electronics and Information, Hangzhou Dianzi University, Hangzhou, China
– sequence: 2
  givenname: Wen-Sheng
  orcidid: 0000-0002-2507-5776
  surname: Zhao
  fullname: Zhao, Wen-Sheng
  email: wsh.zhao@gmail.com
  organization: MOE Engineering Research Center of Smart Microsensors and Microsystems, School of Electronics and Information, Hangzhou Dianzi University, Hangzhou, China
– sequence: 3
  givenname: Da-Wei
  orcidid: 0000-0001-5612-6313
  surname: Wang
  fullname: Wang, Da-Wei
  email: davidw.zoeq@gmail.com
  organization: MOE Engineering Research Center of Smart Microsensors and Microsystems, School of Electronics and Information, Hangzhou Dianzi University, Hangzhou, China
– sequence: 4
  givenname: Qi
  orcidid: 0000-0003-4034-5831
  surname: Liu
  fullname: Liu, Qi
  organization: MOE Engineering Research Center of Smart Microsensors and Microsystems, School of Electronics and Information, Hangzhou Dianzi University, Hangzhou, China
– sequence: 5
  givenname: Shichang
  surname: Chen
  fullname: Chen, Shichang
  organization: MOE Engineering Research Center of Smart Microsensors and Microsystems, School of Electronics and Information, Hangzhou Dianzi University, Hangzhou, China
– sequence: 6
  givenname: Gaofeng
  orcidid: 0000-0001-8599-7249
  surname: Wang
  fullname: Wang, Gaofeng
  email: gaofeng@hdu.edu.cn
  organization: MOE Engineering Research Center of Smart Microsensors and Microsystems, School of Electronics and Information, Hangzhou Dianzi University, Hangzhou, China
BookMark eNp9kE1PwkAQhjcGEwH9AcZL_0Bxdrfd7h4JUTCBeFDisVn2Q8bUlnQrhn_vFogHDx4m85F5Ju-8IzKom9oRckthQimo--XqbTZhwGDCgSkQcEGGNM9lSguRDfqa05RyUFdkFMIHAM1kRodkPq2TddW1eovv2-TF1QE73GN3SFZo2uZb791x2rSJj3Ec-uoLLZpkuttVaHSHTR2uyaXXVXA35zwm68eH19kiXT7Pn2bTZWqY4l0qFZdOSM-jQqNsoY3zlHshpQVrVL5R2ikrWB4biPptVtAN2-RWcFZYofiYFKe7UUcIrfOlwe4oIf6AVUmh7P0oez_K3o_y7Eck6R9y1-Knbg__MncnBp1zv_uKsbwAwX8AK7BuJQ
CODEN IMWCBJ
CitedBy_id crossref_primary_10_1109_JSEN_2024_3432072
crossref_primary_10_1109_JSEN_2023_3294243
crossref_primary_10_1109_TIM_2025_3544708
crossref_primary_10_1016_j_measurement_2024_115279
crossref_primary_10_1109_TMTT_2023_3276208
crossref_primary_10_1109_JSEN_2021_3085954
crossref_primary_10_1109_LMWT_2023_3258629
crossref_primary_10_1109_TIM_2024_3413132
crossref_primary_10_1016_j_cap_2025_01_018
crossref_primary_10_1515_freq_2022_0115
crossref_primary_10_1109_JSEN_2021_3124294
crossref_primary_10_3390_s22051764
crossref_primary_10_1038_s41598_023_41035_2
crossref_primary_10_1109_LSENS_2022_3224445
crossref_primary_10_1016_j_sna_2022_113699
crossref_primary_10_1109_JSEN_2024_3361911
crossref_primary_10_1109_TCSI_2024_3382304
crossref_primary_10_1016_j_measurement_2023_113864
crossref_primary_10_1109_JSEN_2022_3169768
crossref_primary_10_1109_JSEN_2024_3380579
crossref_primary_10_1109_JSEN_2023_3342878
crossref_primary_10_1109_TAP_2024_3452427
crossref_primary_10_1109_JSEN_2022_3211566
crossref_primary_10_3390_bios13050541
crossref_primary_10_1109_JSEN_2023_3307193
crossref_primary_10_3390_s23062884
crossref_primary_10_1109_JSEN_2024_3425311
crossref_primary_10_1088_1361_6463_ac893e
crossref_primary_10_1109_JSEN_2021_3074169
crossref_primary_10_1109_TIE_2021_3063873
crossref_primary_10_3390_s22218534
crossref_primary_10_3390_mi14071378
crossref_primary_10_3390_s22186946
crossref_primary_10_1109_JSEN_2023_3264878
crossref_primary_10_1017_S1759078724001089
crossref_primary_10_1109_LMWT_2023_3286911
crossref_primary_10_1109_TMTT_2022_3199242
crossref_primary_10_1109_JSEN_2021_3090086
crossref_primary_10_3390_s21206811
crossref_primary_10_1109_ACCESS_2023_3317697
crossref_primary_10_1109_ACCESS_2024_3416392
crossref_primary_10_1109_LSENS_2022_3159800
crossref_primary_10_1109_JSEN_2024_3486163
crossref_primary_10_1109_LSENS_2024_3491764
crossref_primary_10_1109_TMTT_2022_3222419
crossref_primary_10_1016_j_irbm_2025_100883
crossref_primary_10_1016_j_sna_2021_112866
crossref_primary_10_1109_TCPMT_2024_3463874
crossref_primary_10_3390_s24061840
crossref_primary_10_1109_JSEN_2024_3404455
crossref_primary_10_1109_JSEN_2024_3485815
crossref_primary_10_1016_j_aeue_2021_154099
crossref_primary_10_1109_JSEN_2023_3280240
crossref_primary_10_1109_JSEN_2025_3532844
crossref_primary_10_3390_s22249748
crossref_primary_10_1016_j_sna_2024_116154
crossref_primary_10_1109_JSEN_2021_3114625
crossref_primary_10_1007_s11220_025_00567_9
crossref_primary_10_1016_j_sna_2024_115860
crossref_primary_10_1109_JIOT_2024_3361009
Cites_doi 10.1109/TMTT.2019.2932737
10.1002/mop.29979
10.1109/TDEI.2006.1667730
10.1109/JSEN.2013.2295312
10.1007/s00339-019-3186-4
10.1109/TMTT.2009.2034226
10.1109/TMTT.2012.2231877
10.3390/s18114005
10.1063/1.471197
10.1109/JSEN.2013.2244035
10.1109/MMM.2011.2181448
10.1109/TMTT.2014.2299514
10.1109/JSEN.2020.2973196
ContentType Journal Article
DBID 97E
RIA
RIE
AAYXX
CITATION
DOI 10.1109/LMWC.2020.3029060
DatabaseName IEEE All-Society Periodicals Package (ASPP) 2005–Present
IEEE All-Society Periodicals Package (ASPP) 1998–Present
IEEE Electronic Library (IEL)
CrossRef
DatabaseTitle CrossRef
DatabaseTitleList
Database_xml – sequence: 1
  dbid: RIE
  name: IEEE Electronic Library (IEL)
  url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
Physics
EISSN 1558-1764
EndPage 1204
ExternalDocumentID 10_1109_LMWC_2020_3029060
9225706
Genre orig-research
GrantInformation_xml – fundername: National Key Research and Development Program of China; National Key Research and Development Program
  grantid: 2018YFE0120000
  funderid: 10.13039/501100012166
– fundername: National Natural Science Foundation of China
  grantid: 61874038; 61901146; 61971171
  funderid: 10.13039/501100001809
GroupedDBID -~X
0R~
29I
4.4
5GY
5VS
6IK
97E
AAJGR
AARMG
AASAJ
AAWTH
ABAZT
ABQJQ
ABVLG
ACGFO
ACIWK
AENEX
AETIX
AFFNX
AGQYO
AGSQL
AHBIQ
AIBXA
AKJIK
AKQYR
ALMA_UNASSIGNED_HOLDINGS
ATWAV
BEFXN
BFFAM
BGNUA
BKEBE
BPEOZ
CS3
DU5
EBS
EJD
F5P
HZ~
H~9
IFIPE
IPLJI
JAVBF
LAI
M43
O9-
OCL
RIA
RIE
RNS
AAYXX
CITATION
RIG
ID FETCH-LOGICAL-c293t-8938e68f3060c9d7acef13f688d0dc95b9ae9d625dc90155d471b2b5d6327d693
IEDL.DBID RIE
ISSN 1531-1309
IngestDate Tue Jul 01 01:00:42 EDT 2025
Thu Apr 24 23:10:04 EDT 2025
Wed Aug 27 02:28:32 EDT 2025
IsPeerReviewed true
IsScholarly true
Issue 12
Language English
License https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html
https://doi.org/10.15223/policy-029
https://doi.org/10.15223/policy-037
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-c293t-8938e68f3060c9d7acef13f688d0dc95b9ae9d625dc90155d471b2b5d6327d693
ORCID 0000-0002-2507-5776
0000-0001-8599-7249
0000-0003-4034-5831
0000-0001-5612-6313
PageCount 4
ParticipantIDs ieee_primary_9225706
crossref_citationtrail_10_1109_LMWC_2020_3029060
crossref_primary_10_1109_LMWC_2020_3029060
ProviderPackageCode CITATION
AAYXX
PublicationCentury 2000
PublicationDate 2020-12-01
PublicationDateYYYYMMDD 2020-12-01
PublicationDate_xml – month: 12
  year: 2020
  text: 2020-12-01
  day: 01
PublicationDecade 2020
PublicationTitle IEEE microwave and wireless components letters
PublicationTitleAbbrev LMWC
PublicationYear 2020
Publisher IEEE
Publisher_xml – name: IEEE
References ref13
ref12
ref14
ref11
ref10
ref2
ref1
ref8
ref7
ref9
ref4
ref6
ref5
mandel (ref3) 2011
References_xml – ident: ref5
  doi: 10.1109/TMTT.2019.2932737
– ident: ref9
  doi: 10.1002/mop.29979
– ident: ref1
  doi: 10.1109/TDEI.2006.1667730
– ident: ref4
  doi: 10.1109/JSEN.2013.2295312
– ident: ref14
  doi: 10.1007/s00339-019-3186-4
– ident: ref7
  doi: 10.1109/TMTT.2009.2034226
– start-page: 79
  year: 2011
  ident: ref3
  article-title: Passive chipless wireless sensor for two-dimensional displacement measurement
  publication-title: Proc 41st Eur Microw Conf
– ident: ref8
  doi: 10.1109/TMTT.2012.2231877
– ident: ref6
  doi: 10.3390/s18114005
– ident: ref10
  doi: 10.1063/1.471197
– ident: ref11
  doi: 10.1109/JSEN.2013.2244035
– ident: ref2
  doi: 10.1109/MMM.2011.2181448
– ident: ref12
  doi: 10.1109/TMTT.2014.2299514
– ident: ref13
  doi: 10.1109/JSEN.2020.2973196
SSID ssj0014841
Score 2.5578663
Snippet This work shows an ultrahigh sensitivity microwave sensor for microfluidic applications. The proposed sensor is made of a microstrip line loaded with a...
SourceID crossref
ieee
SourceType Enrichment Source
Index Database
Publisher
StartPage 1201
SubjectTerms Attenuation
Complementary split-ring resonator (CSRR)
liquid
microfluidic sensor
Microfluidics
Microstrip
Microwave sensors
parallel plate waveguide
Permittivity
Sensitivity
Title An Ultrahigh Sensitivity Microwave Sensor for Microfluidic Applications
URI https://ieeexplore.ieee.org/document/9225706
Volume 30
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LS8NAEB7agqAHH61ifZGDJzFtXt1mj6VYixgvWuwtdB-BYkmlJgr-emc2aagi4i1ZdmHZ13zfzuw3AJcugmSFptSWrvLsQMw0XTQJGzelJ9yZlMw8j44e2HgS3E170xpcV29htNYm-Ex36NP48tVS5nRV1uUe5VxjdagjcSvealUegyAMSm1U18ZzmZceTNfh3fvoeYhM0EOC6pC6ufPNBm0kVTE2ZbQH0bo3RSjJSyfPREd-_hBq_G9392G3BJfWoFgNB1DTaRN2NiQHm7BlQj7lWwtuB6k1WWR42CA_tx4pkL3IJGFFFKT3MXvXpnS5shDYFoXJIp-rubQGG27vQ5iMbp6GY7tMq2BLtO2ZjQgl1CxMkCw4kqv-TOrE9RMWhspRkvcE6XUr5EX4Q4hKof0Snugp5nt9xbh_BI10mepjsIQSkiCaDjXWChOuNUN7x3zBhQj6Xhuc9UDHstQcp9QXi9hwD4fHNDcxzU1czk0brqomr4Xgxl-VWzTsVcVyxE9-Lz6FbWpcBKOcQSNb5focIUUmLsxa-gL0H8cT
linkProvider IEEE
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwzV1LT8JAEJ4QjFEPPkAjPnvQi0mhXcrSHjwQFEEeFyFyq-yjSiRgoJXob_Gv-N-cbQtBY7yReGs30ybbme58szP7DcCZiSBZoCvVuSmIbrGeVBtNTMefkjCzxzkNj0c3W7TasW67hW4CPuZnYaSUYfGZzKrLMJcvRjxQW2U5h6ieazQuoazLtykGaJPL2hVq85yQynW7XNXjHgI6R0fm6-iObUltD5GxwR1R7HHpmXmP2rYwBHcKTJFTCwwC8EbBB4GLNSOsIGieFAVVVEu4wK8gziiQ6HTYPEdh2VbMxmrq6AmcOGdqGk6u0bwvY-xJMCQ2FJ-68c3rLbRxCb1YZQs-Z_OPilees4HPsvz9BzXkf_1A27AZw2etFNn7DiTkMAUbC6SKKVgNi1r5JA03paHWGfi4nPYfn7Q7Vaof9crQmqoMcdp7leHoaKwhdI8GvUHQF32ulRYS-7vQWcqc9iA5HA3lPmhMMK5AqLQlStmeIyVFj07zzGHMKpIMGDPFujxmVVfNPQZuGF0ZjqtswVW24Ma2kIGL-SMvEaXIX8Jppea5YKzhg9-HT2Gt2m423EatVT-EdfWiqPTmCJL-OJDHCKB8dhLasQYPy7aLL43HJCk
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=An+Ultrahigh+Sensitivity+Microwave+Sensor+for+Microfluidic+Applications&rft.jtitle=IEEE+microwave+and+wireless+components+letters&rft.au=Fan%2C+Li-Chao&rft.au=Zhao%2C+Wen-Sheng&rft.au=Wang%2C+Da-Wei&rft.au=Liu%2C+Qi&rft.date=2020-12-01&rft.issn=1531-1309&rft.eissn=1558-1764&rft.volume=30&rft.issue=12&rft.spage=1201&rft.epage=1204&rft_id=info:doi/10.1109%2FLMWC.2020.3029060&rft.externalDBID=n%2Fa&rft.externalDocID=10_1109_LMWC_2020_3029060
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=1531-1309&client=summon
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=1531-1309&client=summon
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=1531-1309&client=summon