Energy Consumption and Carbon Emission Reduction in HVAC System of a Dynamic Random Access Memory (DRAM) Semiconductor Fabrication Plant (fab)

• Published in: IEEE transactions on semiconductor manufacturing Vol. 37; no. 2; pp. 174 - 184
• Main Authors: Liao, Pin-Yen, Lin, Tee, Ali Zargar, Omid, Hsu, Chia-Jen, Chou, Chia-Hung, Shih, Yang-Cheng, Hu, Shih-Cheng, Leggett, Graham
• Format: Journal Article
• Language: English
• Published: New York IEEE 01.05.2024; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Air conditioning; Air temperature; Carbon; Carbon dioxide; Carbon emissions; Dynamic random access memory; Emissions control; Energy conservation; Energy consumption; Energy consumption reduction; Energy conversion; energy conversion factors (ECF); Enthalpy; fab energy simulation software (FES); HVAC; HVAC equipment; Industrial plants; Net zero; net-zero emission; Power demand; Production costs; Random access memory; Software; Taiwan

This study focuses on energy saving for a Taiwan high-tech DRAM factory as the primary research subject. Collecting operational parameters related to various facility systems and process equipment is initially performed by using the developed energy conversion factors (ECF) calculator. Moreover, inn...