Liao, P., Lin, T., Ali Zargar, O., Hsu, C., Chou, C., Shih, Y., . . . Leggett, G. (2024). Energy Consumption and Carbon Emission Reduction in HVAC System of a Dynamic Random Access Memory (DRAM) Semiconductor Fabrication Plant (fab). IEEE transactions on semiconductor manufacturing, 37(2), 174-184. https://doi.org/10.1109/TSM.2024.3379949
Chicago Style (17th ed.) CitationLiao, Pin-Yen, Tee Lin, Omid Ali Zargar, Chia-Jen Hsu, Chia-Hung Chou, Yang-Cheng Shih, Shih-Cheng Hu, and Graham Leggett. "Energy Consumption and Carbon Emission Reduction in HVAC System of a Dynamic Random Access Memory (DRAM) Semiconductor Fabrication Plant (fab)." IEEE Transactions on Semiconductor Manufacturing 37, no. 2 (2024): 174-184. https://doi.org/10.1109/TSM.2024.3379949.
MLA (9th ed.) CitationLiao, Pin-Yen, et al. "Energy Consumption and Carbon Emission Reduction in HVAC System of a Dynamic Random Access Memory (DRAM) Semiconductor Fabrication Plant (fab)." IEEE Transactions on Semiconductor Manufacturing, vol. 37, no. 2, 2024, pp. 174-184, https://doi.org/10.1109/TSM.2024.3379949.