Microstructure and shear properties evolution of Mn-doped SAC solder joint under isothermal aging

• Published in: Journal of iron and steel research, international Vol. 30; no. 8; pp. 1650 - 1660
• Main Authors: Li, Cheng-ming, Chen, Shu-jin, Cai, Shan-shan, Peng, Ju-bo, Wang, Xiao-jing, Wang, Ying-wu
• Format: Journal Article
• Language: English
• Published: Singapore Springer Nature Singapore 01.08.2023
• Subjects: Applied and Technical Physics; Engineering; Machines; Manufacturing; Materials Engineering; Materials Science; Metallic Materials; Original Paper; Physical Chemistry; Processes; Shear mechanical behavior; Isothermal aging; Interfacial intermetallic compound; SAC305 solder; Mn doping

The effects of Mn addition (0.005, 0.01, 0.03, 0.05, and 0.07 wt.%) on microstructure, shear mechanical behavior, and interfacial thermal stabilities of SAC305 joints were investigated under isothermal aging temperatures of 170 °C with different aging time (0, 250, 500, and 750 h). It is found that...