A Singly-Fed Dual-Band Microstrip Antenna for Microwave and Millimeter-Wave Applications in 5G Wireless Communication

The coexistence of microwave (MW) and millimeter wave (MMW) technologies is considered as the development tendency of the future 5G wireless communication system. In this paper, a single-port, single-layer, dual-band antenna with large frequency ratio is proposed to support the MW and MMW applicatio...

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Published inIEEE transactions on vehicular technology Vol. 70; no. 6; pp. 5419 - 5430
Main Authors Guo, Yu Qing, Pan, Yong Mei, Zheng, Shao Yong, Lu, Kai
Format Journal Article
LanguageEnglish
Published New York IEEE 01.06.2021
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
5G mobile communication
5G wireless communication
Antenna feeds
Antennas
Bandwidths
Dual band
Dual-band antenna
Impedance
large frequency ratio
Linear arrays
Microstrip
microstrip antenna
Microstrip antenna arrays
Microstrip antennas
Microstrip transmission lines
Millimeter waves
millimeter-wave antenna
Patches (structures)
Wireless communication systems
Wireless communications
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Abstract The coexistence of microwave (MW) and millimeter wave (MMW) technologies is considered as the development tendency of the future 5G wireless communication system. In this paper, a single-port, single-layer, dual-band antenna with large frequency ratio is proposed to support the MW and MMW applications. This antenna mainly consists of a stub-loaded microstrip line in the center, two slot-loaded rectangular patches on the lateral sides, and two thin microstrip lines in-between which connect the former two. The stub-loaded microstrip line works as a series-fed MMW linear array at 26 GHz, and simultaneously it serves as the feed line for the MW patches operating at 4.85 GHz. The connection lines are elaborately designed to isolate the MW patches from the MMW signal, guaranteeing the radiation performance of the antenna at the two bands without requiring complicated filter. For verification, a prototype is fabricated and measured. The measured results show that the antenna has an impedance bandwidth of 3.1% and a peak gain of 8.93 dBi at the 4.85-GHz MW band, while an impedance bandwidth of 19% and a peak gain of 13.57 dBi at the 26-GHz MMW band.
AbstractList The coexistence of microwave (MW) and millimeter wave (MMW) technologies is considered as the development tendency of the future 5G wireless communication system. In this paper, a single-port, single-layer, dual-band antenna with large frequency ratio is proposed to support the MW and MMW applications. This antenna mainly consists of a stub-loaded microstrip line in the center, two slot-loaded rectangular patches on the lateral sides, and two thin microstrip lines in-between which connect the former two. The stub-loaded microstrip line works as a series-fed MMW linear array at 26 GHz, and simultaneously it serves as the feed line for the MW patches operating at 4.85 GHz. The connection lines are elaborately designed to isolate the MW patches from the MMW signal, guaranteeing the radiation performance of the antenna at the two bands without requiring complicated filter. For verification, a prototype is fabricated and measured. The measured results show that the antenna has an impedance bandwidth of 3.1% and a peak gain of 8.93 dBi at the 4.85-GHz MW band, while an impedance bandwidth of 19% and a peak gain of 13.57 dBi at the 26-GHz MMW band.
Author Pan, Yong Mei
Lu, Kai
Zheng, Shao Yong
Guo, Yu Qing
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  organization: School of Information Science and Technology, Sun Yat-sen University, Guangzhou, China
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Cites_doi 10.1109/LAWP.2015.2443013
10.1109/TAP.2018.2882616
10.1109/LAWP.2018.2803775
10.1109/TAP.2017.2786321
10.1109/TAP.2016.2565740
10.1109/TVT.2019.2899178
10.1109/TAP.2019.2938584
10.1109/TAP.2019.2948571
10.1109/MCOM.2014.6894457
10.1109/ACCESS.2020.2964721
10.1109/TVT.2019.2923338
10.1109/TAP.2019.2943409
10.1109/LAWP.2015.2490079
10.1109/TVT.2020.2996360
10.1109/TAP.2018.2800705
10.1109/ACCESS.2020.2969274
10.1109/TAP.2015.2412962
10.1109/JPROC.2019.2961937
10.1049/el:20010739
10.1109/TAP.2017.2700225
10.1109/TAP.2018.2882697
10.1109/TAP.2017.2712819
10.1109/TAP.2004.835144
10.1109/TAP.2019.2916559
10.1109/TAP.2019.2922547
10.1109/ACCESS.2018.2829606
10.1109/TAP.2017.2758165
10.1109/TAP.2019.2894270
10.1109/TAP.2017.2740963
10.1109/TVT.2020.2982743
10.1109/TAP.2012.2215295
10.1109/TAP.2020.3008668
10.1109/TAP.2017.2708093
10.1109/TAP.2019.2891336
10.1109/TAP.2019.2948706
10.1109/TAP.2013.2278858
10.1109/TVT.2020.2966009
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References ref35
ref13
ref34
ref12
ref37
ref15
ref36
ref14
ref31
ref30
ref33
ref11
ref32
ref10
ref2
ref1
ref17
ref16
ref18
ref24
ref23
ref26
ref25
ref20
ref22
ref21
ref28
ref27
ref29
ref8
ref7
ref9
ref4
tu (ref19) 2013; 61
ref3
ref6
ref5
References_xml – ident: ref34
  doi: 10.1109/LAWP.2015.2443013
– ident: ref14
  doi: 10.1109/TAP.2018.2882616
– ident: ref15
  doi: 10.1109/LAWP.2018.2803775
– ident: ref35
  doi: 10.1109/TAP.2017.2786321
– ident: ref21
  doi: 10.1109/TAP.2016.2565740
– ident: ref7
  doi: 10.1109/TVT.2019.2899178
– ident: ref23
  doi: 10.1109/TAP.2019.2938584
– ident: ref26
  doi: 10.1109/TAP.2019.2948571
– ident: ref6
  doi: 10.1109/MCOM.2014.6894457
– ident: ref17
  doi: 10.1109/ACCESS.2020.2964721
– ident: ref1
  doi: 10.1109/TVT.2019.2923338
– ident: ref36
  doi: 10.1109/TAP.2019.2943409
– ident: ref13
  doi: 10.1109/LAWP.2015.2490079
– ident: ref3
  doi: 10.1109/TVT.2020.2996360
– ident: ref25
  doi: 10.1109/TAP.2018.2800705
– ident: ref30
  doi: 10.1109/ACCESS.2020.2969274
– ident: ref12
  doi: 10.1109/TAP.2015.2412962
– ident: ref9
  doi: 10.1109/JPROC.2019.2961937
– ident: ref22
  doi: 10.1049/el:20010739
– ident: ref28
  doi: 10.1109/TAP.2017.2700225
– ident: ref29
  doi: 10.1109/TAP.2018.2882697
– ident: ref5
  doi: 10.1109/TAP.2017.2712819
– ident: ref24
  doi: 10.1109/TAP.2004.835144
– ident: ref20
  doi: 10.1109/TAP.2019.2916559
– ident: ref33
  doi: 10.1109/TAP.2019.2922547
– ident: ref10
  doi: 10.1109/ACCESS.2018.2829606
– ident: ref16
  doi: 10.1109/TAP.2017.2758165
– ident: ref32
  doi: 10.1109/TAP.2019.2894270
– ident: ref2
  doi: 10.1109/TAP.2017.2740963
– ident: ref8
  doi: 10.1109/TVT.2020.2982743
– ident: ref18
  doi: 10.1109/TAP.2012.2215295
– ident: ref37
  doi: 10.1109/TAP.2020.3008668
– ident: ref11
  doi: 10.1109/TAP.2017.2708093
– ident: ref27
  doi: 10.1109/TAP.2019.2891336
– ident: ref31
  doi: 10.1109/TAP.2019.2948706
– volume: 61
  start-page: 5776
  year: 2013
  ident: ref19
  article-title: A ceramic antenna for tri-band radio devices
  publication-title: IEEE Trans Antennas Propag
  doi: 10.1109/TAP.2013.2278858
– ident: ref4
  doi: 10.1109/TVT.2020.2966009
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Snippet The coexistence of microwave (MW) and millimeter wave (MMW) technologies is considered as the development tendency of the future 5G wireless communication...
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SubjectTerms 5G mobile communication
5G wireless communication
Antenna feeds
Antennas
Bandwidths
Dual band
Dual-band antenna
Impedance
large frequency ratio
Linear arrays
Microstrip
microstrip antenna
Microstrip antenna arrays
Microstrip antennas
Microstrip transmission lines
Millimeter waves
millimeter-wave antenna
Patches (structures)
Wireless communication systems
Wireless communications
Title A Singly-Fed Dual-Band Microstrip Antenna for Microwave and Millimeter-Wave Applications in 5G Wireless Communication
URI https://ieeexplore.ieee.org/document/9395221
https://www.proquest.com/docview/2549758970
Volume 70
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