Qualitative and Quantitative Analysis of Multi-Pattern Wafer Bin Maps

• Published in: IEEE transactions on semiconductor manufacturing Vol. 33; no. 4; pp. 578 - 586
• Main Authors: Kong, Yuting, Ni, Dong
• Format: Journal Article
• Language: English
• Published: New York IEEE 01.11.2020; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Artificial neural networks; boundary detection; convolutional neural network; Convolutional neural networks; Feature extraction; Monitoring; Multi-pattern wafer map; overlapped pattern segmentation; Pattern analysis; Qualitative analysis; Quantitative analysis; Segmentation; Segments; Semiconductor device manufacture; semiconductor manufacturing

Wafer map analysis is one of the most critical steps for monitoring wafer quality and tracking failures in the semiconductor manufacturing process. Defective dies on wafer bin maps (WBMs) usually cluster into specific spatial patterns, which contain critical information for cause identification and...