APA (7th ed.) Citation

Kong, Y., & Ni, D. (2020). Qualitative and Quantitative Analysis of Multi-Pattern Wafer Bin Maps. IEEE transactions on semiconductor manufacturing, 33(4), 578-586. https://doi.org/10.1109/TSM.2020.3022431

Chicago Style (17th ed.) Citation

Kong, Yuting, and Dong Ni. "Qualitative and Quantitative Analysis of Multi-Pattern Wafer Bin Maps." IEEE Transactions on Semiconductor Manufacturing 33, no. 4 (2020): 578-586. https://doi.org/10.1109/TSM.2020.3022431.

MLA (9th ed.) Citation

Kong, Yuting, and Dong Ni. "Qualitative and Quantitative Analysis of Multi-Pattern Wafer Bin Maps." IEEE Transactions on Semiconductor Manufacturing, vol. 33, no. 4, 2020, pp. 578-586, https://doi.org/10.1109/TSM.2020.3022431.