A One-Shot Learning Approach for Similarity Retrieval of Wafer Bin Maps With Unknown Failure Pattern

• Published in: IEEE transactions on semiconductor manufacturing Vol. 35; no. 1; pp. 40 - 49
• Main Authors: Kong, Yuting, Ni, Dong
• Format: Journal Article
• Language: English
• Published: New York IEEE 01.02.2022; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Commonality; Convolutional neural networks; Deep learning; Failure; Failure analysis; Feature extraction; Generative adversarial networks; Generators; Morphology; one-shot learning; Retrieval; Semiconductor device modeling; semiconductor manufacturing; Similarity; Training; Troubleshooting; unknown pattern detection; Wafer map retrieval

Due to the increasing complexity of semiconductor manufacturing, new process failures occur and cause unknown types of defective patterns on wafer bin maps (WBMs). Similar patterns have a high probability of being induced by the identical process failure. The commonality analysis of unknown patterns...