Research on the Durability of Metal-Packaged Fiber Bragg Grating Sensors
Compared to conventional adhesive packaging for fiber Bragg grating (FBG) sensors, metal packaging is considered a new and robust method with excellent advantages such as stability and resistance to high and low temperatures. Current research mainly focuses on metal coating methods, the enhancement...
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Published in | IEEE photonics technology letters Vol. 31; no. 7; pp. 525 - 528 |
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Main Authors | , , |
Format | Journal Article |
Language | English |
Published |
New York
IEEE
01.04.2019
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects | |
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Abstract | Compared to conventional adhesive packaging for fiber Bragg grating (FBG) sensors, metal packaging is considered a new and robust method with excellent advantages such as stability and resistance to high and low temperatures. Current research mainly focuses on metal coating methods, the enhancement of temperature sensing characteristics, and the method of welding onto the substrate. However, the durability of the metal packaging, which determines the measurement accuracy and lifetime of a metal-coated FBG sensor, has been ignored. This letter introduces our long-term investigation of the durability of three metal-packaged FBG sensors over the past four years. The metal packaging process for the bare FBGs and sensor substrates, the experimental design, and the test methods are presented. The research results show that the central wavelength of a prestretched metallized FBG decreases due to natural aging after 10 months and that its sensing capabilities, such as its negative strain detection capacity, sensitivity, linearity, and repeatability, significantly degrade after 48 months, revealing a deficiency in our current understanding. |
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AbstractList | Compared to conventional adhesive packaging for fiber Bragg grating (FBG) sensors, metal packaging is considered a new and robust method with excellent advantages such as stability and resistance to high and low temperatures. Current research mainly focuses on metal coating methods, the enhancement of temperature sensing characteristics, and the method of welding onto the substrate. However, the durability of the metal packaging, which determines the measurement accuracy and lifetime of a metal-coated FBG sensor, has been ignored. This letter introduces our long-term investigation of the durability of three metal-packaged FBG sensors over the past four years. The metal packaging process for the bare FBGs and sensor substrates, the experimental design, and the test methods are presented. The research results show that the central wavelength of a prestretched metallized FBG decreases due to natural aging after 10 months and that its sensing capabilities, such as its negative strain detection capacity, sensitivity, linearity, and repeatability, significantly degrade after 48 months, revealing a deficiency in our current understanding. |
Author | Yongxing Guo Li Xiong Honghai Liu |
Author_xml | – sequence: 1 givenname: Yongxing orcidid: 0000-0003-4579-488X surname: Guo fullname: Guo, Yongxing – sequence: 2 givenname: Li orcidid: 0000-0002-9764-101X surname: Xiong fullname: Xiong, Li – sequence: 3 givenname: Honghai surname: Liu fullname: Liu, Honghai |
BookMark | eNo9kEFPAjEQhRuDiYDeTbw08bw4s-3u0qOigAlGonhuSncKi7iL7XLg31sC8TCZN8l785Kvxzp1UxNjtwgDRFAPs_likAKqQaoAIFcXrItKYgJYyE7UEDWiyK5YL4QNAMpMyC6bflAg4-2aNzVv18Sf994sq23VHnjj-Bu1ZpvMjf02Kyr5uFqS50_erFZ84k1b1Sv-SXVofLhml85sA92cd599jV8Wo2kye5-8jh5niU0VtkmRgTRolQWId-lSKMA46ZwiSEWphoqkckthXSFzdHHy3Em0GZoS04xEn92f_u5887un0OpNs_d1rNQpqnwoRVGI6IKTy_omBE9O73z1Y_xBI-gjLx156SMvfeYVI3enSEVE__ZhLoUqMvEHvZRmZw |
CODEN | IPTLEL |
CitedBy_id | crossref_primary_10_3390_ma16082943 crossref_primary_10_1016_j_yofte_2024_103855 crossref_primary_10_1109_JSEN_2020_3027569 crossref_primary_10_1109_ACCESS_2020_2966235 crossref_primary_10_1088_1742_6596_1646_1_012063 crossref_primary_10_1109_JSEN_2019_2930761 crossref_primary_10_3390_s20174689 crossref_primary_10_1364_OPTCON_471726 crossref_primary_10_1109_JSEN_2021_3124030 crossref_primary_10_1109_JSEN_2022_3213929 crossref_primary_10_1109_JSEN_2020_2967088 crossref_primary_10_1109_JSEN_2021_3130615 crossref_primary_10_1088_1402_4896_acc619 crossref_primary_10_1016_j_yofte_2023_103386 crossref_primary_10_1016_j_yofte_2019_102035 crossref_primary_10_1109_JSEN_2022_3181949 crossref_primary_10_1109_JSEN_2024_3391827 crossref_primary_10_1016_j_ijleo_2023_170632 crossref_primary_10_1016_j_ijleo_2019_03_019 crossref_primary_10_3788_COL202321_090007 crossref_primary_10_3390_s19112556 crossref_primary_10_1007_s13320_022_0671_8 crossref_primary_10_1111_str_12354 crossref_primary_10_1016_j_measurement_2023_113691 crossref_primary_10_1108_SR_10_2020_0243 crossref_primary_10_1109_LPT_2019_2942646 |
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ContentType | Journal Article |
Copyright | Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2019 |
Copyright_xml | – notice: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2019 |
DBID | 97E RIA RIE AAYXX CITATION 7SP 7U5 8FD L7M |
DOI | 10.1109/LPT.2019.2900069 |
DatabaseName | IEEE All-Society Periodicals Package (ASPP) 2005-present IEEE All-Society Periodicals Package (ASPP) 1998–Present IEEE Xplore CrossRef Electronics & Communications Abstracts Solid State and Superconductivity Abstracts Technology Research Database Advanced Technologies Database with Aerospace |
DatabaseTitle | CrossRef Solid State and Superconductivity Abstracts Technology Research Database Advanced Technologies Database with Aerospace Electronics & Communications Abstracts |
DatabaseTitleList | Solid State and Superconductivity Abstracts |
Database_xml | – sequence: 1 dbid: RIE name: IEEE Xplore url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/ sourceTypes: Publisher |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Applied Sciences Engineering Physics |
EISSN | 1941-0174 |
EndPage | 528 |
ExternalDocumentID | 10_1109_LPT_2019_2900069 8643975 |
Genre | orig-research |
GrantInformation_xml | – fundername: National Natural Science Foundation of China grantid: 51605348; 51827812; 51575338 funderid: 10.13039/501100001809 |
GroupedDBID | -~X 0R~ 29I 4.4 5GY 6IK 97E AAJGR AASAJ ABQJQ ABVLG ACGFO ACGFS ACIWK AENEX AKJIK ALMA_UNASSIGNED_HOLDINGS ATWAV BEFXN BFFAM BGNUA BKEBE BPEOZ CS3 DU5 EBS EJD F5P HZ~ IFIPE IPLJI JAVBF LAI M43 O9- OCL P2P RIA RIE RIG RNS TN5 TWZ AAYXX CITATION 7SP 7U5 8FD L7M |
ID | FETCH-LOGICAL-c291t-7504a1c9c00291df2070af4ff9e023d989e49fb3cf7461f46166f41c51ad125e3 |
IEDL.DBID | RIE |
ISSN | 1041-1135 |
IngestDate | Thu Oct 10 15:35:51 EDT 2024 Fri Aug 23 01:05:20 EDT 2024 Wed Jun 26 19:27:54 EDT 2024 |
IsPeerReviewed | false |
IsScholarly | true |
Issue | 7 |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-c291t-7504a1c9c00291df2070af4ff9e023d989e49fb3cf7461f46166f41c51ad125e3 |
ORCID | 0000-0002-9764-101X 0000-0003-4579-488X |
PQID | 2196843773 |
PQPubID | 85439 |
PageCount | 4 |
ParticipantIDs | proquest_journals_2196843773 ieee_primary_8643975 crossref_primary_10_1109_LPT_2019_2900069 |
PublicationCentury | 2000 |
PublicationDate | 2019-04-01 |
PublicationDateYYYYMMDD | 2019-04-01 |
PublicationDate_xml | – month: 04 year: 2019 text: 2019-04-01 day: 01 |
PublicationDecade | 2010 |
PublicationPlace | New York |
PublicationPlace_xml | – name: New York |
PublicationTitle | IEEE photonics technology letters |
PublicationTitleAbbrev | LPT |
PublicationYear | 2019 |
Publisher | IEEE The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher_xml | – name: IEEE – name: The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
References | ref15 ref14 ref11 ref10 ref2 ref1 ref8 ref7 ref4 ref3 yun (ref9) 2014; 23 changjin (ref13) 2016; 63 ref6 li (ref12) 2009; 7 ref5 |
References_xml | – ident: ref14 doi: 10.1016/j.snb.2017.04.103 – ident: ref1 doi: 10.1016/j.sna.2016.08.020 – volume: 7 start-page: 115 year: 2009 ident: ref12 article-title: A plating method for metal coating of fiber Bragg grating publication-title: Chin Opt Lett doi: 10.3788/COL20090702.0115 contributor: fullname: li – ident: ref7 doi: 10.1364/OE.19.006141 – volume: 63 start-page: 762 year: 2016 ident: ref13 article-title: Effects of metal coating on the fiber Bragg grating temperature sensing characteristics publication-title: J Mod Opt doi: 10.1080/09500340.2015.1100341 contributor: fullname: changjin – ident: ref10 doi: 10.1109/TMECH.2010.2047111 – ident: ref3 doi: 10.1109/LPT.2017.2712602 – ident: ref15 doi: 10.1109/LPT.2016.2572762 – ident: ref4 doi: 10.1016/j.measurement.2017.12.030 – volume: 23 year: 2014 ident: ref9 article-title: Fabrication and characterization of a metal-packaged regenerated fiber Bragg grating strain sensor for structural integrity monitoring of high-temperature components publication-title: Smart Mater Struct contributor: fullname: yun – ident: ref6 doi: 10.1016/j.yofte.2012.04.001 – ident: ref5 doi: 10.1109/JSEN.2016.2577610 – ident: ref2 doi: 10.1109/JSEN.2018.2812820 – ident: ref8 doi: 10.1016/j.sna.2014.03.023 – ident: ref11 doi: 10.1117/12.966835 |
SSID | ssj0014534 |
Score | 2.4509358 |
Snippet | Compared to conventional adhesive packaging for fiber Bragg grating (FBG) sensors, metal packaging is considered a new and robust method with excellent... |
SourceID | proquest crossref ieee |
SourceType | Aggregation Database Publisher |
StartPage | 525 |
SubjectTerms | Aging (metallurgy) Aging (natural) Design of experiments Durability FBG sensors Fiber Bragg grating (FBG) Fiber gratings Linearity Low temperature resistance Metal coatings metal packaging Metallizing Metals Optical fiber sensors Optical fibers Packaging Sensors Substrates Test procedures Welding |
Title | Research on the Durability of Metal-Packaged Fiber Bragg Grating Sensors |
URI | https://ieeexplore.ieee.org/document/8643975 https://www.proquest.com/docview/2196843773 |
Volume | 31 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LS8NAEB5sQdCD1apYX-zBi2DabLKbdI--ahErBRW8hX32UEikj4P-enc3SSnqwUMghyQs-83OI_PNDMBFTITinImAY85sgMJoIGisAi6sRJkoFMZXpY2ek-EbeXyn7xtwtaqF0Vp78pnuulufy1eFXLpfZb2-N5-0AY2UsbJWa5UxILTMIIcEBxjHtE5Jhqz3NH51HC7WjdyETEdtXjNBfqbKL0XsrcugBaN6XSWpZNpdLkRXfv1o2fjfhe_CTuVmoutSLvZgQ-dtaFUuJ6oO9LwN22v9CNuw6fmgcr4Pw5qRh4ocWR8R3S1nZUfvT1QYNNLWZw_GXE6tOlJo4Ggn6GbGJxP04EQqn6AXGx8Xs_kBvA3uX2-HQTV0IZARw4vAtXvnWDLp8nVYWbjSkBtiDNPWvCvWZ5owI2JpUpJgY68kMQRLirmyzpKOD6GZF7k-AqT6lFKlRBTGkqiQ8Ujz1LjZ9oRLwnAHLmscso-yt0bmY5KQZRazzGGWVZh1YN9t6-q5akc7cFoDl1WHb55ZJZz0SZym8fHfb53Alvt2ScA5heZittRn1rdYiHMvVN-d5MmG |
link.rule.ids | 315,783,787,799,27937,27938,55087 |
linkProvider | IEEE |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LT9tAEB6FVBVwIBBAhFLYA5dKOHjtXdt7LG3T0CZRJILEzdpnDkg2yuMAv57dtR1FbQ89WPLBllc7szPfeL6ZAbiOiVCcMxFwzJkNUBgNBI1VwIXVKBOFwviqtPEkGT6SX0_0qQU3m1oYrbUnn-m-u_W5fFXKtftVdpt590l34IPF1VlaVWttcgaEVjnkkOAA45g2ScmQ3Y6mM8fiYv3Izch05OYtJ-Snqvxlir1_GXRg3KysopU899cr0ZdvfzRt_N-lH8JBDTTR10ozjqCliy50atCJ6iO97ML-VkfCLnz0jFC5PIZhw8lDZYEsSkTf14uqp_crKg0aa4vagymXz9YgKTRwxBN0t-DzOfrplKqYowcbIZeL5Qk8Dn7Mvg2DeuxCICOGV4Fr-M6xZNJl7LCyAktDbogxTFsHr1jGNGFGxNKkJMHGXkliCJYUc2Xhko5PoV2UhT4DpDJKqVIiCmNJVMh4pHlq3HR7wiVhuAdfGjnkL1V3jdxHJSHLrcxyJ7O8llkPjt22bp6rd7QHF43g8vr4LXNrhpOMxGkan__7rSvYHc7Go3x0P_n9Cfbcdyo6zgW0V4u1_myRxkpcegV7B1dtzNI |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Research+on+the+Durability+of+Metal-Packaged+Fiber+Bragg+Grating+Sensors&rft.jtitle=IEEE+photonics+technology+letters&rft.au=Guo%2C+Yongxing&rft.au=Li%2C+Xiong&rft.au=Liu%2C+Honghai&rft.date=2019-04-01&rft.pub=The+Institute+of+Electrical+and+Electronics+Engineers%2C+Inc.+%28IEEE%29&rft.issn=1041-1135&rft.eissn=1941-0174&rft.volume=31&rft.issue=7&rft.spage=525&rft_id=info:doi/10.1109%2FLPT.2019.2900069&rft.externalDBID=NO_FULL_TEXT |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=1041-1135&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=1041-1135&client=summon |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=1041-1135&client=summon |