Low-Temperature (70°C) Cu-to-Cu Direct Bonding by Capping Metal Layers - Liu, Demin; Chen, Po-Chih; Liu, Yu-Wei; Hu, Han-Wen; Chen, Kuan-Neng (IEEE electron device letters, 2021)
Keywords: 3D integration; Bonding; Budgets; Capping; Chemical bonds; Chromium; Copper; Cu bonding; Diffusion; Gold; Grain size; Low temperature; Low vacuum; metal passivation; Oxidation; Passivation; Recrystallization; Rough surfaces; Surface roughness; Temperature measurement; Wetting