APA (7th ed.) Citation

Liu, D., Chen, P., Liu, Y., Hu, H., & Chen, K. (2021). Low-Temperature (70°C) Cu-to-Cu Direct Bonding by Capping Metal Layers. IEEE electron device letters, 42(10), 1524-1527. https://doi.org/10.1109/LED.2021.3105434

Chicago Style (17th ed.) Citation

Liu, Demin, Po-Chih Chen, Yu-Wei Liu, Han-Wen Hu, and Kuan-Neng Chen. "Low-Temperature (70°C) Cu-to-Cu Direct Bonding by Capping Metal Layers." IEEE Electron Device Letters 42, no. 10 (2021): 1524-1527. https://doi.org/10.1109/LED.2021.3105434.

MLA (9th ed.) Citation

Liu, Demin, et al. "Low-Temperature (70°C) Cu-to-Cu Direct Bonding by Capping Metal Layers." IEEE Electron Device Letters, vol. 42, no. 10, 2021, pp. 1524-1527, https://doi.org/10.1109/LED.2021.3105434.