Convolutional Neural Networks for Automatic Virtual Metrology

• Published in: IEEE robotics and automation letters Vol. 6; no. 3; pp. 5720 - 5727
• Main Authors: Hsieh, Yu-Ming, Wang, Tan-Ju, Lin, Chin-Yi, Peng, Li-Hsuan, Cheng, Fan-Tien, Shang, Sui-Yan
• Format: Journal Article
• Language: English
• Published: Piscataway IEEE 01.07.2021; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Accuracy; Algorithms; Artificial neural networks; Automatic virtual metrology (AVM); Back propagation networks; convolutional neural networks (CNN); Cycle time; Data models; deep learning; Feature extraction; Inspection; Machine learning; Manufacturing; Metrology; Neural networks; Real time; Sampling; Semiconductor device modeling; Semiconductor process modeling; Virtual networks; Workpieces

To ensure stable manufacturing and high yield of production, factories (e.g., semiconductor or TFT-LCD fabs) conduct quality inspection on workpieces. They tend to adopt sampling inspection in consideration of reducing cost and cycle time, yet that fails to achieve real-time and online total inspect...