Multiple-Time Reentrant Processes Optimization of Robotic Dual-Arm Cluster Tools With Cleaning Operations

• Published in: IEEE access Vol. 13; pp. 57101 - 57118
• Main Authors: Li, Tan, Lai, Yiming, Shao, Yonghua, Zhan, Sijun, Qiao, Yan
• Format: Journal Article
• Language: English
• Published: Piscataway IEEE 2025; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Algorithms; Atomic layer epitaxy; Chemicals; Cleaning; Cluster tool; Clusters; Delay time; Delays; Fabrication; Job shop scheduling; Modules; Optimal scheduling; Plasma enhanced chemical vapor deposition; Process control; reentrant process; Residual gas; Robots; Schedules; Scheduling; Semiconductors; Time factors; Wafers

Cluster tools are the key equipment in semiconductors manufacturing. Such a tool has been used for some reentrant wafer fabrication processes, such as atomic layer deposition and plasma enhanced chemical vapor deposition. With reentrant processes, wafers need to visit some processing modules for mul...