A fundamental study of improving thermal interface connection by using silane modified, in-situ formed silver-graphene fillers in epoxy polymers for future semiconductor device packaging

• Published in: Composites science and technology Vol. 230; p. 109759
• Main Authors: Sun, Zhijian, Wong, Ryan, Liu, Yifan, Yu, Michael, Li, Jiaxiong, Liu, Huilong, An, Dong, Moran, Macleary, Muslu, Ahmet Mete, Wong, Ching-Ping
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 10.11.2022
• Subjects: Epoxy nanocomposites; graphene nanosheets; In-situ formed silver nanoparticles; Semiconductor packaging; Thermal interfacial connection; Thermal interfacial connection; Semiconductor packaging; Epoxy nanocomposites; graphene nanosheets; In-situ formed silver nanoparticles

Over the past half-century, the increase of on-chip power and on-chip integration density has created new thermal management challenges for 2.5D/3D semiconductor packaging. High-performance thermal management materials in electronic encapsulation are very important to ensure the performance and reli...