Electrical and Mechanical Behavior of Aerosol Jet–Printed Gold on Alumina Substrate for High‐Temperature Applications

• Published in: Advanced engineering materials Vol. 25; no. 20
• Main Authors: Alshatnawi, Firas, Alhendi, Mohammed, Abbara, El Mehdi, Sivasubramony, Rajesh, Garakani, Behnam, Enakerakpo, Emuobosan, Shaddock, David, Stoffel, Nancy, Hoel, Cathleen, Poliks, Mark D., Borgesen, Peter
• Format: Journal Article
• Language: English
• Published: 01.10.2023

There is a growing interest in the development of microelectronics that can perform reliably and robustly at temperatures above 300 °C. Such devices require stable thermal properties, low thermal drift, and thermal cycling resistance. Conventional hybrid circuit technology demonstrates high‐temperat...