Experimental of ultra-high-power multichip COB LED Thermal dissipation mode using a cycle approach of refrigeration

• Published in: Journal of thermal analysis and calorimetry Vol. 136; no. 5; pp. 2097 - 2109
• Main Authors: Hsu, Chih-Neng, Wang, Wei-Chuan, Fang, Shih-Hao
• Format: Journal Article
• Language: English
• Published: Cham Springer International Publishing 15.06.2019
• Subjects: Analytical Chemistry; Chemistry; Chemistry and Materials Science; Inorganic Chemistry; Measurement Science and Instrumentation; Physical Chemistry; Polymer Sciences; COB (chip on board); Refrigeration cycle; LED; Thermal dissipation; Environment-friendly refrigerant; Ultra-high-power
• ISSN: 1388-6150; 1588-2926
• DOI: 10.1007/s10973-018-7806-6

In solid-state COB (chip on board) LED (light-emitting diode), the process technology is enhanced, brightness of light per power is improved, and optical performance is increased. However, the COB LED chip junction temperature, T j , is still a disadvantage in critically high hot spots and high temperatures. These disadvantages can shorten life and reduce efficiency. Therefore, T j must also be solved. From a single-crystal silicon chip packaging LED to multichip COB packaging LED, this tool has become the most mainstream item in the market development of high brightness. Therefore, investigating the research approach and techniques needed to solve the high temperature T j is necessary. In this study, the system can be used an environment-friendly refrigerant as R407C and R134a systems for a thermal cooling temperature and constant flow compression refrigeration cycle system that cool ultra-high-power multichip COB and high-brightness gallium indium nitride LED heat source. To reduce the COB LED chip, T j , temperature needs to reach the following specifications: < 125 °C to maximum 150 °C and T case  < 50 °C to maximum 85 °C. This temperature will maintain good luminous efficiency and long life. In addition, this approach aims to solve the maximum power of thermal dissipation T j .