Dislocation micromechanisms under single slip conditions
The microstructures formed in the early stage of deformation of Cu, Al, and TiAl in single slip and at low temperatures are analysed. While dislocations are highly mobile in Cu and Al, they are subject to a significant lattice friction in TiAl. Also, they are dissociated over a few nm in Cu, not in...
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Published in | International journal of materials research Vol. 97; no. 3; pp. 189 - 199 |
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Main Authors | , , |
Format | Journal Article |
Language | English |
Published |
De Gruyter
11.01.2022
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Subjects | |
Online Access | Get full text |
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