Dislocation micromechanisms under single slip conditions

The microstructures formed in the early stage of deformation of Cu, Al, and TiAl in single slip and at low temperatures are analysed. While dislocations are highly mobile in Cu and Al, they are subject to a significant lattice friction in TiAl. Also, they are dissociated over a few nm in Cu, not in...

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Bibliographic Details
Published inInternational journal of materials research Vol. 97; no. 3; pp. 189 - 199
Main Authors Veyssière, Patrick, Chiu, Yu-Lung, Niewczas, Marek
Format Journal Article
LanguageEnglish
Published De Gruyter 11.01.2022
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