APA (7th ed.) Citation

Chen, S., Lin, P., & Chiang, C. (2022). A high-frequency electromagnetic stamping system for high-throughput stamping of microdimples. Journal of materials processing technology, 303, 117527. https://doi.org/10.1016/j.jmatprotec.2022.117527

Chicago Style (17th ed.) Citation

Chen, Shun-Tong, Po-An Lin, and Chao-Jung Chiang. "A High-frequency Electromagnetic Stamping System for High-throughput Stamping of Microdimples." Journal of Materials Processing Technology 303 (2022): 117527. https://doi.org/10.1016/j.jmatprotec.2022.117527.

MLA (9th ed.) Citation

Chen, Shun-Tong, et al. "A High-frequency Electromagnetic Stamping System for High-throughput Stamping of Microdimples." Journal of Materials Processing Technology, vol. 303, 2022, p. 117527, https://doi.org/10.1016/j.jmatprotec.2022.117527.