Research Progress of Interfacial Modification of Copper/Diamond Composites for Electronic Packaging

• Published in: International journal of thermophysics Vol. 46; no. 9
• Main Authors: Hu, Zhihua, Zhang, Bowen, Yu, Hongmei, Lei, Yan, Xiong, Haiyan, Jiang, Binghua, Chen, Deping
• Format: Journal Article
• Language: English
• Published: New York Springer US 01.09.2025; Springer Nature B.V
• Subjects: Chemical bonds; Chemical reactions; Classical Mechanics; Composite materials; Condensed Matter Physics; Contact angle; Copper; Diffusion; Electronic packaging; Heat transfer; Industrial Chemistry/Chemical Engineering; Metallizing; Physical Chemistry; Physics; Physics and Astronomy; Thermal conductivity; Thermal expansion; Transport properties; Wettability; Zirconium; Electronic packaging materials; Thermal conductivity; Diamond; Copper-matrix composites; Interfacial modification

Copper/diamond composites exhibit significant potential in various fields, including microelectronics, weaponry, power batteries and aerospace, owing to their adjustable transport properties, high thermal conductivity (TC), and customizable coefficients of thermal expansion. However, interface gaps...